Aehr Receives Order for Multiple FOX-NP™ Wafer Level Test and Burn-in Systems for Test and Qualification of Silicon Photonics Devices
Fremont, CA (February 20, 2019) – Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it has received a $2.4 million order from a leading semiconductor manufacturer for Aehr’s new FOX-NP Test and Burn-in Systems. The FOX-NP systems compliment the customer’s existing fleet of FOX-XPTM Test and Burn-in Systems to provide additional test and qualification capacity as a result of increasing variety of silicon photonics devices. The FOX-NP Systems are expected to ship within the next six months.
The FOX-NP system is a new configuration within the FOX-PTM product family and is a low-cost entry-level system that is 100% compatible with the FOX-XP system. The FOX-NP and the FOX-XP systems are configurable with up to two or eighteen FOX-P independent testers respectively each with their own independent test system, test interface, and conductive thermal chuck.
The FOX-NP and FOX-XP test and burn-in systems enable full wafer contact of two to eighteen wafers in parallel at 50% to 90% smaller footprint than traditional semiconductor test systems that can test a maximum of only one wafer at a time.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “This customer is one of the world’s largest semiconductor manufacturers, and we are excited to receive this order for multiple FOX-NP systems and to see their continuing ramp-up in wafer-level burn-in capacity. The FOX-NP system provides a configuration and price point for companies to do initial production qualification and New Product Introduction, or NPI, which allows an easier transition to our high-volume FOX-XP system for new customers. In the case of this lead customer, having multiple FOX-NP systems enables them to run many wafers at several different temperatures in parallel at completely different process variations and burn-in conditions as part of their qualification process. Each FOX-NP system has its own thermal control system to allow independent temperatures and control of its FOX-P independent testers. This customer is forecasting significant growth in shipments for silicon photonics devices that we expect to drive the need for additional production burn-in capacity for multiple years into the future.
“We continue to be very optimistic about the silicon photonics and photonics sensors markets and believe they will be significant growth drivers for Aehr. Market Research Engine projects silicon photonics for data center and high-performance computing to grow at a compounded rate of 26.8% from 2017 through 2024. The rapid growth of integrated optical devices in mobile devices, high-performance servers and data centers, automotive applications, and now wearable biosensor markets, is driving substantially higher requirements for initial quality and long-term reliability, and they are increasing with every new product generation. We believe these new applications are driving an entirely new level of quality and reliability expectation for these systems and pose a significant long-term growth opportunity for Aehr.”
Aehr’s FOX-P systems are the company’s next-generation multi-wafer and singulated die/module test solution that are capable of functional test and burn-in/cycling of photonics devices, flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer, bare die and module form before they are assembled into single or multi-die stacked packages. The FOX wafer-level systems utilize Aehr’s FOX WaferPak Contactors, which provide cost effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The new configuration with the DiePak® Carriers also enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr products in package, wafer level, and singulated die/module level test. Aehr has developed and introduced several innovative products, including the ABTS™ and FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr’s website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements based on current expectations, forecasts and assumptions that involve risks and uncertainties. These statements are based on information available to Aehr as of the date hereof and actual results could differ materially from those stated or implied due to risks and uncertainties. Forward-looking statements include statements regarding Aehr’s expectations, beliefs, intentions or strategies regarding its products, including statements regarding future market opportunities and conditions, expected product shipment dates and customer orders or commitments. These risks and uncertainties include, without limitation, customer demand and acceptance of Aehr’s products, the ability of new products to meet customer needs or perform as described, as well as general market conditions and Aehr’s ability to execute on its business strategy. See Aehr’s recent 10-K, 10-Q and other reports from time to time filed with the Securities and Exchange Commission for a more detailed description of the risks facing Aehr’s business. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.
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