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Packaged Parts Test and Burn-in Solutions

ABTS

The Advanced Burn-In and Test System (ABTS) solution provides flexibility for the test / burn-in of packaged semiconductor devices. The solution consists of the ABTS system that provides power, stimulus, test and thermal management. It supports common Burn-in Boards (BIBs) that hold the Devices Under Test (DUT) and a wide range of BIB Loaders for automated loading / unloading DUTs to / from BIBs.

ABTS

A high capacity system for test and burn-in of logic devices
  • More DUTs per System
    • Larger BIBs – up to 610 mm x 610 mm
    • More BIBs – up to 72
    • More iSockets* (up to 64 per BIB)   *iSocket is a trademark of Sensata Technologies
  • More Power – 650 W up to 1200 W per BIB
  • Better Chamber
    • More Power Dissipation – up to 36 KW
    • Better Airflow & Temperature Uniformity
    • Narrow and Wide Chamber options
    • Air and Water System Cooling options
    • Small System footprint, no side access required
  • More Flexibility –Better Loading, Better ROI
    • Up to 36 different programs can be run in the same system at the same time
  • ABTS-P
    • True Per-pin Tester Architecture (timing, formatting, tristate, voltage)
    • 72 BIB capacity
    • 2 BIBs per program zone
    • 128 independent I/O channels/BIB
    • 10MHz data rate
  • ABTS-Pi
    • Independent device temperature control for high power devices using Sensata iSocket or VTR technology
    • Up to 36KW of chamber power dissipation
    • True Per-pin Tester Architecture (timing, formatting, tristate, voltage)
    • Up to 36 BIB capacity
    • 1 BIB per program zone
    • 256 independent I/O channels/BIB
    • 10MHz data rate
  • ABTS-L
    • Up to 72 BIB capacity
    • 1 or 2 BIBs per program zone
    • Up to 320 I/O channels/BIB
    • 10MHz data rate
  • ABTS-Li
    • Independent device temperature control for high power devices using Sensata iSocket or VTR technology
    • Up to 36KW of chamber power dissipation
    • Up to 56 BIB capacity
    • 2 BIBs per program zone
    • 132 I/O channels/BIB
    • 10MHz data rate
  • ABTS-M
    • Up to 72 BIB capacity
    • Burn-in and test of all DRAM, Flash and SRAM devices
    • N, N2, N3/2 algorithmic pattern generation
    • Cassette handling of BIBs

Automated ABTS BIB Loader

Automated Burn-In Board (BIB) loading and unloading solution
  • Multiple Burn-in Boards (BIBs) input and Output
  • Trolleys Available for Transport of BIBs to/from Burn-in System and Loader/Unloader
  • Device Input and Output Using JEDEC Tray Stacks (Other Types of Trays Also)
  • Pass/Fail Sorting of Devices
  • Very High Throughput Using Pick and Place of Multiple Devices at Once
  • Fast Change-over for Different Devices
  • Open Top or Lidded Device Sockets
  • Very High Reliability

Burn-in Boards

Boards used to hold and connect one or more Devices Under Test (DUTs) to the power and test resources of the ABTS system
  • Very Economical BIB Format
    • Economical PC Fab Size
    • Multiple vendors around the world
    • Card-edge Connector Interface
      • No Connector Cost
    • Non-proprietary Interface
      • No License Fees
  • BIB sizes supported
    • Standard: 20.67” x 22.67” (525 mm x 576 mm)
    • Custom up to 24” square (610 mm square)