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Single Wafer Test and Burn-in Solutions

FOX-1P

Integrated massively parallel single wafer test and burn-in systems.

FOX-CP

Full Wafer Test System

Compact Test and Reliability Verification Solution for Logic/Memory/Photonic Devices
  • Compact Solution for High Throughput Reliability Verification and Test
    • Capable of testing thousands of die in a single touchdown
    • Identifies failing logic/memory/photonic die before final package integration
    • Integrated system with wafer handling and stepping capabilities
    • Full-wafer test system using a WaferPak™ contactor and wafer prober available with a high performance thermal chuck for high power wafer requirements
  • Configurable Channel Resources for Full-Wafer Test and Reliability Verification
    • Multiple resource modules are available: Universal Channel Modules, High Voltage Channel
      Modules or High Current Channel Modules
    • Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) with deep scan,
      pattern data and capture memory per channel for test of devices with BIST/DFT
    • Up to 1,024 high voltage (29 V) or high current (2 A) sources resources
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Reduces test cost by functionally testing wafer during reliability verification
    • Compatible with industry standard probers and probe cards
    • Protects wafers and probe cards with per channel over-current and over-voltage protection

FOX-1P

Full Wafer Test System

High Power Test and Reliability Verification Solution for Logic / Memory / Photonic Devices
  • Enables High Throughput, Single Touchdown, Full Wafer Production Testing
    • Capable of simultaneously testing up to 16,000 die in a single wafer touchdown
    • Resource configurable up to 16,384 “ Universal Channels ” – each programmable as an
      I/O, Clock, Pin Parametric Measurement Unit ( P PMU ) or Device Power Supply ( DPS )
    • Software-enabled per site flexibility to support small and large device pin count test needs
  • Comprehensive functional and parametric test capabilities
    • Deep functional pattern data and capture memory optimized for BIST/DFT testing
    • Per channel PMU for per site parametric testing
    • Individual channel over-current protection to protect wafers and probe cards
  • Configured for high volume production
    • Compatible with industry standard probers and probe cards
    • Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F
    • Configurable as a single or dual system integrated test cell

FOX WaferPak Contactor

Single Touchdown Full-Wafer Test & Burn-in

  • Delivers FOX-XP system resources to the wafer enabling single touchdown test and burn-in
    • May be designed for up to 300 mm wafer sizes
    • Production proven with > 50,000 contacts per wafer
    • Pad Metallurgy: Al, Cu, Au or solder balls
    • Temperature range: Ambient to 150° C
  • Supports up to 2,048 I/O and DPS channels with remote voltage and ground sense per pin
    • Handles up to 4 amps per contact
  • Handles up to 2 kW of power dissipation
  • Enables high volume full wafer production test and burn-in with one touchdown
  • Field repairable carrier