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Die Level Test and Burn-in Solutions

FOX-XP

The FOX-XP solution is a highly flexible test/burn-in solution which can be configured to support DiePak Carriers for singulated die/module test. An optional automated DiePak Loader is available for loading/unloading devices into FOX DiePak Carriers to increase throughput.

FOX-XP

Full Wafer & Singulated Die / Module Test System

High Throughput Burn-in and Test Solution for Logic/Memory/Photonic Devices
  • High Throughput Reliability Verification and Test System for Volume Production
    • Handles full wafers / panels / singulated die / modules for highest production throughput
    • Identifies failing logic / memory / photonic die before final package integration
    • High power system with up to 18 Blades (slots) for wafer or panel testing using WaferPakTM
      contactors or 9 Blade capability for singulated die / module DiePak® carriers
  • Configurable Channel Resources
    • Multiple resource modules available per Blade (slot): Universal Channel Modules, High Voltage
      Channel Modules or High Current Channel Modules
    • Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep
      scan, pattern data and capture memory per channel for test of devices with BIST/DFT
    • Up to 1,024 high voltage (29V) or high current (2A) sources resources per Blade
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Reduces test costs by functionally testing wafers/die/modules during reliability verification
    • Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer
      Aligner / DiePak Loader
    • Protects devices with individual per channel over-current and over-voltage protection

FOX-NP

Full Wafer & Singulated Die / Module Test System

Compact High Power Test and Reliability Verifications Solution for Logic/Memory/Photonic Devices
  • Compact Flexible Solution for High Throughput Reliability Verification and Test
    • Handles full wafer / panel / singulated die / module applications
    • Identifies failing logic/memory/photonic die before final package integration
    • High power thermal chuck dual Blade (slot) capability using WaferPak™ contactors or DiePak®
      carriers (for singulated die/modules)
  • Cost-Effective Solution for High Power Wafer/Die/Module Verification and Test
    • Configurable channel resources per Blade (slot): Universal Channel Modules, High Voltage
      Channel Modules or High Current Channel Modules
    • Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep
      scan, pattern data and capture memory per channel for test of devices with BIST/DFT
    • Up to 1,024 high voltage (29 V) or high current (2 A) sources resources per Blade
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Reduces test costs by functionally testing wafers/die/modules during reliability verification
    • Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer
      Aligner / DiePak Loader
    • Protects devices with individual per channel over-current and over-voltage protection

Automated DiePak Loader

Device Loader/Unloader for FOX DiePak Carriers

  • Automated Solution for Loading and Unloading Modules & Singulated Die
    • Loads and unloads devices between JEDEC trays and DiePak carriers
    • Handles: QFN, CSP, QFP, TSOP, BGA and EMMC devices
    • Contains JEDEC bin trays for device test sorting
  • Precision Socket Loading/Unloading
    • Precision alignment ensured with DiePak carrier specific alignment kit designed for handling device to socket alignment and placement in a DiePak carrier
  • Production Proven Full-Wafer Burn-in & Test Solution
    • Based upon an industry-leading pick and place handler design
    • Optical bar code reading of JEDEC tray, DiePak carrier and device IDs for error free operation and device traceability
    • Includes a DiePak Trolley for easy loading of DiePak carriers into the FOX-XP system
  • Integrated Solution with FOX-XP system
    • Enables automated selection of test program based on device/lot ID
    • Shares traceability of devices and test results with FOX-XP system

FOX DiePak Carrier

Singulated Die / Module Test & Burn-in

  • Delivers FOX-XP system resources to up to 1,024 singulated die / modules per DiePak carrier, enabling high density test and burn-in
  • Supports up to 2,048 I/O and DPS channels with remote voltage and ground sense per pin
  • DiePak sockets are custom designed per application by Aehr Test to ensure electrical performance and burn-in temperature stability
  • Optional optical measurement capability incorporated into each socket
  • Handles up to 2 kW of power dissipation per DiePak Carrier
  • Temperature range: Ambient to 150° C
  • Field repairable carrier