Aehr Test Systems to Exhibit at the Semiconductor Wafer Test Workshop June 3-6, 2018 in San Diego CA

Will showcase FOX-XPTM solutions for wafer-level burn-in and test of logic, optical and memory devices

FREMONT, Calif., June 01, 2018 (GLOBE NEWSWIRE) — Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will be exhibiting at the Semiconductor Wafer Test Workshop (SWTW) taking place June 3-6, 2018 at the Rancho Bernardo Inn in San Diego, California (Booth #7).

The Company will be showcasing its solutions for wafer-level burn-in and test of logic, optical and memory devices, including its FOX-XP next generation test and burn-in system for high volume production and early failure rate (EFR) test. The FOX-XP system has been developed to burn-in and test today’s next generation of devices being integrated into automotive, mobility, and security (including facial and gesture recognition) products, enabling volume production test and burn-in of wafers and chip-scale packages for those applications.

“The automotive, mobile and computing markets are driving substantially higher requirements for initial quality and long-term reliability of ICs, sensors and integrated optical devices,” commented Gayn Erickson, President and CEO of Aehr Test Systems. “Our FOX wafer-level test and burn-in systems, featuring our WaferPakTM full-wafer contactors, enable reliability testing of these mission-critical devices to be done at the wafer level, prior to assembly into modules and end products. SWTW offers an excellent forum for companies to share their ideas and methods to meet the increasing safety and reliability requirements of these applications.”

SWTW is the only event that focuses on all the aspects associated with microelectronic wafer and die level testing, where attendees come to learn about recent developments in the industry and exchange ideas, gain insights, tools and practical guidance. This premier technology forum will showcase many of the key suppliers to the wafer probe industry and feature a mix of manufacturer and vendor presentations with plenty of time for informal discussion and networking. Additional information on the conference can be found on the SWTW website at

In concert with the theme of the conference, Aehr Test is showcasing its solutions for burn-in and test of logic, optical and memory devices to enhance the reliability of devices produced by semiconductor manufacturers. These solutions include:

  • The FOX family of products, which includes multi-wafer test solutions that are capable of functional test and burn-in/cycling of flash memories, microcontrollers and other leading edge ICs in wafer form before they are assembled into multi-die stacked packages. The FOX systems utilize Aehr Test’s FOX WaferPak or DiePak® contactors, which provide a cost effective solution for making electrical contact with a full wafer, panel, singulated die or module in a parallel test and burn-in environment.
  • The FOX-XP system, the company’s next-generation multi-wafer and now singulated die/module test solution that is capable of functional test and burn-in/cycling of integrated photonics devices, flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer form before they are assembled into single or multi-die stacked packages. The new configuration with the DiePak Carriers also enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. These singulated known-good die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at

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