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Multi Wafer Test and Burn-in Solutions

FOX-XP

The FOX-XP solution is a highly flexible test/burn-in solution which can be configured to support WaferPak Contactors for full wafer test. An optional FOX-XP WaferPak Aligner is available for aligning wafers into FOX WaferPak Contactors to increase throughput.

 

Aehr Test Systems provides complete production wafer testing solutions across your product manufacturing flow to improve yield and reliability.

FOX-XP

Multi Wafer & Singulated Die / Module Test System

High Throughput Burn-in and Test Solution for Logic/Memory/Photonic Devices
  • High Throughput Reliability Verification and Test System for Volume Production
    • Handles full wafers / panels / singulated die / modules for highest production throughput
    • Identifies failing logic / memory / photonic die before final package integration
    • High power system with up to 18 Blades (slots) for wafer or panel testing using WaferPakTM
      contactors or 9 Blade capability for singulated die / module DiePak® carriers
  • Configurable Channel Resources
    • Multiple resource modules available per Blade (slot): Universal Channel Modules, High Voltage
      Channel Modules or High Current Channel Modules
    • Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep
      scan, pattern data and capture memory per channel for test of devices with BIST/DFT
    • Up to 1,024 high voltage (29V) or high current (2A) sources resources per Blade
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Reduces test costs by functionally testing wafers/die/modules during reliability verification
    • Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer
      Aligner / DiePak Loader
    • Protects devices with individual per channel over-current and over-voltage protection

FOX-NP

Full Wafer & Singulated Die / Module Test System

Compact High Power Test and Reliability Verifications Solution for Logic/Memory/Photonic Devices
  • Compact Flexible Solution for High Throughput Reliability Verification and Test
    • Handles full wafer / panel / singulated die / module applications
    • Identifies failing logic/memory/photonic die before final package integration
    • High power thermal chuck dual Blade (slot) capability using WaferPak™ contactors or DiePak®
      carriers (for singulated die/modules)
  • Cost-Effective Solution for High Power Wafer/Die/Module Verification and Test
    • Configurable channel resources per Blade (slot): Universal Channel Modules, High Voltage
      Channel Modules or High Current Channel Modules
    • Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) per Blade with deep
      scan, pattern data and capture memory per channel for test of devices with BIST/DFT
    • Up to 1,024 high voltage (29 V) or high current (2 A) sources resources per Blade
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Reduces test costs by functionally testing wafers/die/modules during reliability verification
    • Offers a total solution when configured with a WaferPak contactor / DiePak carrier and Wafer
      Aligner / DiePak Loader
    • Protects devices with individual per channel over-current and over-voltage protection

Automated FOX-XP WaferPak Aligner

Wafer Loader/Unloader for FOX WaferPak Contactors

  • Automated Solution for Loading, Aligning and Unloading of Wafers
    • Loads and unloads wafers between FOUPs or cassettes and WaferPak contactors
    • Dual FOUP/cassette interface enables automated handling of up to 50 wafers
    • Handles and aligns up to 300 mm wafer sizes
    • May be used with a FOX-XP or FOX-15 System
  • Precision Wafer Handling and Pad to Probe Alignment
    • Optical alignment via multiple cameras assures correct wafer to probe alignment and placement in a WaferPak contactor
  • Production Proven Full-Wafer Burn-in & Test Solution
    • Based upon an industry-leading wafer prober platform
    • Optical bar code reading of FOUPs, Wafer IDs and WaferPak contactor IDs for error free operation and wafer traceability
    • May be integrated with a factory automated material handling systems
  • Integrated Solution with FOX-XP system
    • Enables automated selection of test program based on device/lot ID
    • Shares traceability of devices and test results with FOX-XP system

FOX-XP WaferPak Contactor

Single Touchdown Full-Wafer Test & Burn-in

  • Delivers FOX-XP system resources to the wafer enabling single touchdown test and burn-in
    • May be designed for up to 300 mm wafer sizes
    • Production proven with > 50,000 contacts per wafer
    • Pad Metallurgy: Al, Cu, Au or solder balls
    • Temperature range: Ambient to 150° C
  • Supports up to 2,048 I/O and DPS channels with remote voltage and ground sense per pin
    • Handles up to 4 amps per contact
  • Handles up to 2 kW of power dissipation
  • Enables high volume full wafer production test and burn-in with one touchdown
  • Field repairable carrier