Aehr Test Systems to Participate in Two Upcoming Investor Conferences
Gayn Erickson, President and CEO, and Ken Spink, CFO, to participate in annual Craig-Hallum and LD Micro investor conferences
FREMONT, Calif., (GLOBE NEWSWIRE) — Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that Gayn Erickson, President and CEO, and Ken Spink, CFO, will participate in the following upcoming investor conferences:
- 15th Annual Craig-Hallum Institutional Investor Conference, taking place May 30, 2018 at The Depot Renaissance Minneapolis Hotel in Minneapolis, MN. The conference is a series of one-on-one meetings with investors and does not include a formal presentation.
- LD Micro 8th Annual Invitational Investor Conference taking place June 4-6, 2018 at the Luxe Sunset Bel Air Hotel in Los Angeles. Aehr Test is scheduled to present on Wednesday, June 6th at 10:30am Pacific time.
Management will host one-on-one and small group meetings with institutional investors at these conferences. Meetings can be scheduled through the firm hosting each conference or through the MKR Group, Aehr Test’s investor relations firm, at firstname.lastname@example.org.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.
|Aehr Test Systems
Chief Financial Officer
(510) 623-9400 x309
|MKR Group Inc.
Todd Kehrli or Jim Byers