Sonoma and Tahoe
The Sonoma and Tahoe solutions provide flexibility for the test/burn-in of packaged semiconductor devices. The Tahoe system provides slot-level power, stimulus, test and thermal management for low- to medium-power devices supported on Burn-in Boards (BIBs) that are compatible with many BIB loader/unloaders in the market today. The Sonoma system is the high-power solution for devices up to 2000W, with the power, stimulus, and test electronics localized to each device under test.
Sonoma
A high-power system for AI and HPC applications
- High power
- More Reliable Power and Stimulus delivery
- Localized power supplies and stimulus controller for better signal integrity
- Production Ready
- Multi-step test plans
- GUI front end for easy user interaction
- Thermal Management
- Liquid-cooled or air-cooled options
- Up to 2000W per device
- Up to 22 slots per system
- Individual socket thermal control
- Up to 88 liquid cooled and independent test resource positions
- Automotive
- Logic
- System Level Test
- Artificial Intelligence (AI)
- Discrete Devices & Medical
Tahoe
A flexible, modular system for test and burn-in of low- to medium-power logic devices
- More DUTs per System
- Larger BIBs – up to 457mm x 610mm
- Up to 24 BIBs per system
- Individual Socket Thermal Control or Chamber Temperature Control
- Up to 688W per BIB
- Production Ready
- Multi-step test plans
- GUI front end for easy user engagement
- Full lot management with auto adjusting due dates
- Better Chamber
- Better Airflow and Temperature Uniformity
- Small System Footprint
- Automotive
- Logic
- System Level Test
- Artificial Intelligence (AI)
- Discrete Devices & Medical
Sonoma Auto Loader and Unloader
- Fully Automated handling of package parts
- AGV / E84 Compliant for factory automation
- JEDEC tray input/output
- Full traceability with optical ID Readers for JEDEC Trays, DUTs and BIMs
- Automated binning with soft and hard binning to JEDEC Trays
- Optical verification of devices in the sockets
Sonoma Burn-in Modules
Burn-in modules used to hold and connect high power devices under test to the power and test resources of the Sonoma system
- Up to 2000 watts per device
- Up to 128 bi-directional (IO) digital channels
- Up to 25 Mhz vector clock
- Individual temperature control and monitoring
- Liquid cooled or air-cooled options
Tahoe Burn-in Boards
Boards used to hold and connect one or more Devices Under Test (DUTs) to the power and test resources of the Tahoe system
- Economical PC Fab Size
- Card-edge Connector Interface
- Non-proprietary Interface
- BIB size 17.7”x 22.4” (450 mm x 570 mm)