Single Wafer Test and Burn-in Solutions

FOX-CP

Compact Solution for High Throughput Reliability Verification and Test
- Capable of testing thousands of die in a single touchdown
- Identifies failing logic/memory/photonic die before final package integration
- Integrated system with wafer handling and stepping capabilities
- Full-wafer test system using a WaferPak™ contactor and wafer prober available with a high performance thermal chuck for high power wafer requirements

Configurable Channel Resources for Full-Wafer Test and Reliability Verification
- Multiple resource modules are available: Universal Channel Modules, High Voltage Channel
  Modules or High Current Channel Modules
- Up to 2,048 “Universal Channel” resources: (I/O / Clock / PPMU / DPS) with deep scan,
  pattern data and capture memory per channel for test of devices with BIST/DFT
- Up to 1,024 high voltage (29 V) or high current (2 A) sources resources

Production Proven Full-Wafer Reliability Verification & Test Solution
- Reduces test cost by functionally testing wafer during reliability verification
- Compatible with industry standard probers and probe cards
- Protects wafers and probe cards with per channel over-current and over-voltage protection

Delivers FOX-XP system resources to the wafer enabling single touchdown test and burn-in
- May be designed for up to 300 mm wafer sizes
- Production proven with > 50,000 contacts per wafer
- Pad Metallurgy: Al, Cu, Au or solder balls
- Temperature range: Ambient to 150° C

Supports up to 2,048 I/O and DPS channels with remote voltage and ground sense per pin
- Handles up to 4 amps per contact

Enables high volume full wafer production test and burn-in with one touchdown