Press Releases Archives - Aehr Test Systems

Aehr Test Systems Reports Record First Quarter Fiscal 2027 Revenue of $33.0 Million; Raises Full-Year Revenue Outlook to $150 Million, Triple Fiscal 2026 Revenue

John Ryan Roxas — Mon, 02 Nov 2026 22:33:33 +0000

Strong Quarterly Bookings of $46.7 Million; Effective Backlog Reaches $109.3 Million

FREMONT, Calif., November 2, 2026 – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced financial results for its first quarter of fiscal 2027 ended September 25, 2026.

Fiscal First Quarter Financial Results:

Record revenue was $33.0 million, up 200% from $11.0 million in the first quarter of fiscal 2026 and 75% sequentially.
GAAP gross margin was 47.5%, and non-GAAP gross margin was 48.5%.
GAAP net income was $7.2 million, or $0.21 per diluted share, compared with a GAAP net loss of $(2.1) million, or $(0.07) per diluted share, in the first quarter of fiscal 2026.
Non-GAAP net income, which excludes stock-based compensation and acquisition-related adjustments, was $9.4 million, or $0.28 per diluted share, compared with non-GAAP net income of $0.2 million, or $0.01 per diluted share, in the first quarter of fiscal 2026. Non-GAAP net income increased approximately 163% sequentially.
Bookings were $46.7 million, representing a book-to-bill ratio of approximately 1.4.
Backlog was $100.9 million as of September 25, 2026. Effective backlog, including bookings received after quarter end, was $109.3 million as of November 1, 2026.
Cash, cash equivalents and restricted cash totaled $105.1 million as of September 25, 2026, compared to $116.5 million as of May 29, 2026.

An explanation of the use of non-GAAP financial measures and a reconciliation to the most directly comparable GAAP financial measures are included in the accompanying financial tables.

Gayn Erickson, President and CEO of Aehr Test Systems, commented:

“Our fiscal first quarter results demonstrate the accelerating demand for our AI semiconductor test and burn-in solutions and our ability to execute against expanding customer production requirements. Revenue increased 200% year over year and 75% sequentially to a record $33.0 million, while bookings of $46.7 million exceeded revenue by over 40%, reflecting continued strong demand for our wafer-level and package-level burn-in solutions.

“Based on our first quarter performance, substantial backlog, and visibility into customer production requirements, we are raising our fiscal 2027 revenue outlook to $150 million, compared with our previous guidance range of $130 million to $150 million. We expect non-GAAP net income of at least 20% of revenue for fiscal year 2027.

“Demand for our FOX™ wafer-level burn-in (WLBI) solutions remains strong. Our lead AI processor WLBI production customer continues to expand capacity, supported by the $22 million follow-on order announced in August 2026. We have also made significant progress with a major supplier of AI accelerators, CPUs, and network processors that successfully completed a benchmark evaluation last quarter. This customer has decided to purchase a fully configured FOX-XP WLBI test cell for installation at one of its key Outsourced Semiconductor Assembly and Test (OSAT) partners in Taiwan, where the system will be evaluated in a high-volume production environment using the same device that was successfully tested in last quarter’s benchmark. Installation is planned for early calendar 2027, with a decision regarding high-volume production anticipated within several months following installation and validation. We believe this customer represents one of the largest potential burn-in system opportunities Aehr has ever pursued, with significant potential across multiple product lines and manufacturing locations.

“Our Sonoma high-power package-level burn-in (PLBI) business is also expanding rapidly. We are currently shipping and installing more than a dozen systems per month to support our lead hyperscale customer’s production ramp for its first AI processor. The same customer’s second AI processor has now successfully completed qualification on Sonoma, and we have received follow-on orders to support initial production sampling and an anticipated production ramp in calendar 2027. Importantly, the customer forecasts that this second processor will ultimately reach higher production volumes than its first. We are also advancing evaluations with additional AI processor suppliers and hyperscale customers, creating opportunities for new production programs.

“Another important development is the significant diversification of our customer base. Historically, we had only a handful of customers with the potential to generate significant production orders. Today, we see that potential across more than a dozen customers spanning AI processors, silicon photonics, silicon carbide, gallium nitride, and other applications.

“With existing customers expanding production, new AI processor programs advancing toward high-volume production, and an increasingly diversified pipeline of opportunities, we believe Aehr is exceptionally well positioned to capitalize on the growing need for advanced semiconductor test and burn-in solutions over the next several years.”

Financial Guidance

For fiscal 2027 ending June 25, 2027, Aehr now expects:

Revenue of $150 million, compared with its previous guidance range of $130 million to $150 million.
Non-GAAP net income of at least 20% of revenue.

The updated revenue outlook represents 200% growth over fiscal 2026.

The increased outlook reflects Aehr’s strong first quarter performance, substantial backlog, increasing visibility into existing customer production programs, and anticipated production and delivery schedules. Aehr continues to pursue additional opportunities with existing and prospective customers that could support additional growth in fiscal 2027 and beyond.

Management Conference Call and Webcast:

Aehr Test Systems will host a conference call and webcast today at 5:00 p.m. Eastern Time (2:00 p.m. Pacific Time) to discuss its first quarter fiscal 2027 financial results. To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 953740. In addition, a live and archived webcast of the conference call will be available over the Internet at www.aehr.com in the Investor Relations section and may also be accessed by clicking here. A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 54635.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced AI processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and the FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm, enabling IC manufacturers to perform test, burn-in, and stabilization of full wafers on FOX-P systems. The FOX DiePak Carrier allows testing, burn-in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Through its acquisition of Incal Technology, Inc., Aehr added a line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, which position Aehr within the rapidly growing AI market as a turnkey provider of reliability and test solutions that span from engineering to high-volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “forecasts.” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, statements regarding future bookings, backlog, benchmark evaluations and product development from Aehr’s new and existing customers; future applications and orders for AI processors, test solutions for AI semiconductor manufacturers and the Sonoma system; customer forecasts, and production ramps; revenue and revenue growth forecasted; financial performance and bookings forecasted; financial guidance for the fiscal year 2027, including revenue; expectations regarding current and future partnerships; expectations regarding industry demand and emerging technologies as a whole and smaller segments within it; and the ability for Aehr to successfully enter new markets. These forward-looking statements are based on management’s current expectations and assumptions and are subject to risks and uncertainties that could cause actual results to differ materially, including, among others, the non-binding nature of customer forecasts; the possibility that orders are canceled, rescheduled, or delayed; macroeconomic, trade, tariff, and geopolitical conditions, including those affecting Taiwan and Southeast Asia; and conditions in the semiconductor, AI, silicon carbide, GaN, and memory markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s most recent Annual Report on Form 10-K, and subsequent Quarterly Reports on Form 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release, except as required by law.

Effective fiscal 2027, the Company changed its fiscal year-end from the Friday nearest May 31 to the Friday nearest June 30. The three months ended September 25, 2026 reflect the period from June 27, 2026 through September 25, 2026. The one month ended June 26, 2026 represents the transition period (May 30, 2026 to June 26, 2026) between the end of fiscal 2026 and the start of fiscal 2027. Financial information for the three months ended September 26, 2025 is not presented because the fiancial information for the three months ended August 29, 2025 provides a meaningful comparison to the three months ended September 25, 2026.

Represents compensation expense for equity awards granted to employees and directors.
Represents amortization of acquired intangible assets and accretion expense of escrow payable.
Represents employee termination benefits.

Non-GAAP measures should not be considered a replacement for GAAP results. The non-GAAP measures indicated above are financial measures the Company uses to evaluate the underlying results and operating performance of the business. The limitation of these measures are that they exclude items that impact the Company’s current period GAAP measures. This limitation is best addressed by using these measures in combination with the most directly comparable GAAP financial measures. These measures are not in accordance with GAAP and may differ from non-GAAP methods of accounting and reporting used by other companies.

We believe these measures enhance investors’ ability to review the Company’s business from the same perspective as the Company’s management and facilitate comparisons of this period’s results with prior periods.

(1) Includes restricted cash within prepaid expenses and other current assets and other non-current assets.

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson Todd Kehrli Investor Contact tkehrli@pondel.com

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Aehr Test Systems Appoints Former Meta Infrastructure Executive Vijay Rao to Board of Directors

Paul Sevilla — Thu, 29 Oct 2026 11:30:30 +0000

Appointment Adds Hyperscale AI Infrastructure Expertise as Aehr Expands in Semiconductor Test and Burn-In Markets

Fremont, CA (October 29, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced the appointment of Vijay Rao to its Board of Directors, effective October 28, 2026.

Rao brings 30 years of technology industry experience, including more than 13 years at Meta, where he most recently served as Vice President of Infrastructure. His experience spans infrastructure strategy, AI computing, and semiconductor technologies in hyperscale, enterprise, and startup environments.

“Vijay brings deep expertise in infrastructure requirements of hyperscale data centers, including the integration of AI accelerators, high-performance memory, and optical networking,” said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. “He understands firsthand how semiconductor quality and reliability affect system performance and availability at scale. His perspective will be valuable as we advance our wafer-level and package-level test and burn-in solutions and expand our presence in AI and data center applications.”

Rhea Posedel, Chairman of Aehr’s Board of Directors, commented, “Vijay adds valuable insight into the evolving requirements of hyperscale infrastructure operators and the semiconductor technologies supporting them. His combination of technical expertise and strategic experience will strengthen our Board as we guide Aehr’s long-term growth.”

“Deploying AI infrastructure at scale brings semiconductor performance and reliability into sharp focus,” said Rao. “Aehr’s capabilities in wafer-level and package-level test and burn-in address important challenges in semiconductor qualification and production. I look forward to working with the Board and management team as the company builds on these capabilities and pursues its growth opportunities.”

About Vijay Rao

Vijay Rao is a senior technology executive with 30 years of experience leading innovation and strategy across infrastructure, artificial intelligence, and semiconductor technologies in hyperscale, enterprise, and startup environments. He most recently served as Vice President of Infrastructure at Meta, where he was responsible for shaping the strategy and evolution of the technology infrastructure supporting the company’s global operations. During his more than 13 years at Meta, he held senior leadership roles spanning long-term technology strategy and execution, partnering across the industry to drive scalable, high-performance infrastructure and advance the company’s technology capabilities. Previously, he held leadership positions at AMD. He holds a master’s degree in Computer Engineering from Purdue University.

About Aehr Test Systems

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of applicable securities laws, including statements regarding Aehr’s growth opportunities, the future development of AI infrastructure, and the potential contributions of its Board of Directors. These statements involve risks and uncertainties that could cause actual results to differ materially from those expressed or implied. Additional information regarding these risks is included in Aehr’s filings with the Securities and Exchange Commission, including its most recent Forms 10-K and 10-Q. Aehr undertakes no obligation to update forward-looking statements except as required by law.

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli Analyst/Investor Contact tkehrli@pondel.com

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Aehr Test Systems to Announce First Quarter Fiscal 2027 Financial Results on November 2, 2026

Paul Sevilla — Thu, 08 Oct 2026 11:30:37 +0000

Fremont, CA (October 8, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will report financial results for its first quarter of fiscal 2027 ended September 25, 2026 on Monday, November 2, 2026 following the close of the market. The Company will host a conference call and webcast at 5:00 p.m. Eastern time to discuss the results.

As previously announced, Aehr changed its fiscal year end from May to June, shifting its quarterly reporting calendar. The company’s first quarter of fiscal 2027 began on June 27, 2026 and ended on September 25, 2026. Aehr’s fiscal 2027 ends on June 25, 2027.

What:	Aehr Test Systems first quarter fiscal 2027 financial results.
When:	Monday, November 2, at 5:00 p.m. Eastern Time (2:00 p.m. PT).
Dial in Number:	To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 953740.
Webcast:	To access the live webcast, please visit the investor relations section at www.aehr.com.
Call Replay:	A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 54635.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

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Aehr Receives Follow-On Sonoma™ Production Orders for Lead Hyperscale Customer’s Next-Generation AI Processor

Paul Sevilla — Wed, 07 Oct 2026 11:30:24 +0000

Orders supports customer’s second AI processor program on Sonoma, with production expected to ramp in calendar 2027

FREMONT, CA (October 7, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced approximately $6 million in follow-on production orders from its lead hyperscale customer for package-level burn-in (PLBI) of its next-generation AI processor for data center training and inference applications.

The orders include additional Sonoma™ high-power package-level test and burn-in systems, fully turnkey burn-in modules (BIMs) and device-specific sockets, as well as production software enhancements. The systems and consumables will be deployed at one of the customer’s outsourced semiconductor assembly and test (OSAT) partners in Taiwan. Deliveries under the order are scheduled over the next six months.

This next-generation AI processor is the second from this customer to use Aehr’s Sonoma platform for production burn-in. Following the previously announced initial production win, these orders expand the customer’s capacity ahead of an expected production ramp of this second AI device in calendar 2027. The customer has indicated that this second AI processor is expected to ultimately reach production volumes exceeding those of the customer’s first processor brought into production burn-in on the Sonoma platform. That first processor is already in high-volume production, with volumes expected to continue ramping significantly as additional Sonoma system capacity is deployed over the next several months.

“These follow-on production orders demonstrate the continued expansion of our relationship with this hyperscale customer and its confidence in Sonoma to support successive generations of increasingly powerful and complex AI processors,” said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. “The program is progressing from qualification and initial production systems to additional systems, consumables and software supporting the anticipated production ramp. As volumes increase, we believe there is potential for significant additional demand for Sonoma systems and device-specific consumables.”

The next-generation processor requires independently controlled thermal zones within each package to achieve the operating conditions needed for effective production burn-in and early-life failure screening. Sonoma’s multi-zone thermal control capabilities enable independent temperature management across different areas of a device while delivering the high current required to electrically stress the processor.

The platform also supports independent electrical test vectors and monitoring of multiple devices or functional elements within a multi-chip package. These capabilities address the differing power densities and thermal characteristics of advanced AI packages, which increasingly combine compute die, high-bandwidth memory and interface components.

“As AI processors become more complex, controlling the temperature of the package as a whole is no longer sufficient for some applications,” Erickson continued. “Sonoma’s ability to independently manage multiple thermal zones and electrical test functions helps customers address these challenges. We believe these capabilities will become increasingly important as AI packages continue to grow in power, size, complexity and value.”

Aehr is also engaged in detailed discussions with this customer regarding reliability qualification and production burn-in requirements for future generations of higher-power, larger AI devices. These discussions include both Aehr’s Sonoma package-level and FOX-XP™ wafer -level burn-in (WLBI) platforms.

“As the value of advanced AI packages increases, identifying early-life failures before expensive packaging can deliver significant economic benefits,” Erickson added. “WLBI can screen die before assembly, while PLBI can stress and screen the completed device. Customers may choose either approach or use both at different stages of qualification and production, depending on their requirements.”

“Our ability to support both approaches positions Aehr well as customers develop reliability strategies for future AI processors. With Sonoma supporting this customer’s first processor in high-volume production and now its next-generation program, we are building a foundation for continued growth as the customer’s AI roadmap advances.”

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; Aehr’s ability to receive orders and generate revenue in the future, as well as Aehr’s beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr’s ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

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Aehr Test Systems to Participate in 18th Annual CEO Investor Summit 2026 in San Francisco

Paul Sevilla — Mon, 28 Sep 2026 11:30:28 +0000

Fremont, CA (September 28, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that President and CEO Gayn Erickson and CFO Chris Siu will be participating in the 18th Annual CEO Investor Summit being held Tuesday, October 13^th at the St. Regis Hotel, San Francisco, CA.

“We once again look forward to participating in this annual event and discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

The presentation material referenced by Aehr Test at the CEO Summit may be accessed on the investor relations page of the Company’s website at www.aehr.com.

About the 18^th Annual CEO Investor Summit 2026

The CEO Investor Summit is held annually each year during the SEMICON West industry trade show. Collectively hosted and funded by participating companies, the CEO Investor Summit features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 11 management teams during the small group meeting sessions and networking events.

Attendance at the CEO Investor Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is October 2, 2026.

RSVP Contacts for 18^th Annual CEO Investor Summit 2026

To RSVP for the CEO Investor Summit, please visit the CEO Summit Events website or contact either of the event co-chairs:

Laura J. Guerrant-Oiye
Phone: (808) 960-2642
Email: lauraoiye@gmail.com

Claire E. McAdams
Phone: (530) 265-9899
Email: claire@headgatepartners.com

About Aehr Test Systems

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	MKR Investor Relations Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact aehr@mkr-group.com

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Aehr Test Systems to Participate in the 10th Annual Lake Street Capital Markets Best Ideas Growth Conference on September 10

Jway Support — Thu, 03 Sep 2026 20:05:02 +0000

Fremont, CA (September 3, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that President and CEO Gayn Erickson and CFO Chris Siu will be participating in meetings with institutional investors at the Lake Street Capital Markets 10^th Annual Best Ideas Growth Conference taking place Thursday, September 10, 2026 at the Metropolitan Club in New York City.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information or to schedule a meeting with Aehr management, please contact your Lake Street Capital Markets representative or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

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Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026

Jway Support — Sun, 23 Aug 2026 11:30:14 +0000

Fremont, CA (August 21, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the Jefferies semiconductor, IT Hardware & Communications Technology Conference taking place August 24-25, 2026 at the Four Seasons Hotel in Chicago. President and CEO Gayn Erickson and CFO Chris Siu will be hosting meetings with investors throughout the day on Tuesday, August 25.

For additional information or to schedule a meeting with Aehr management, please contact your Jefferies representative or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026 appeared first on Aehr Test Systems.

Aehr Test Systems to Participate in the Needham Virtual Semiconductor and SemiCap 1×1 Conference on August 19

Jway Support — Thu, 13 Aug 2026 11:28:33 +0000

Fremont, CA (August 13, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the 7^th Annual Needham Virtual Semiconductor and SemiCap 1×1 Conference on Wednesday, August 19, 2026. Aehr Test President and CEO Gayn Erickson and CFO Chris Siu will be hosting virtual meetings with investors throughout the day.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon photonics for data centers, 5G infrastructure and optical input/output (I/O), silicon carbide devices in electric vehicles and charging infrastructure, and gallium nitride for advanced power conversion. We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information, or to schedule a meeting with Aehr management, please contact your Needham representative, or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems to Participate in the Needham Virtual Semiconductor and SemiCap 1×1 Conference on August 19 appeared first on Aehr Test Systems.

Aehr Receives $22 Million Follow-On Order for AI Processor Wafer-Level Burn-In Systems

Jway Support — Wed, 12 Aug 2026 11:28:14 +0000

Lead AI processor customer expands production capacity as Aehr sees increasing interest in wafer-level burn-in for advanced AI and high-performance computing devices

FREMONT, CA (August 12, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced a $22 million follow-on production order from its lead wafer-level AI processor customer. The customer is a leading provider of advanced AI training and inference processors.

The order supports the customer’s continued expansion of production capacity utilizing Aehr’s wafer-level burn-in (WLBI) systems and includes multiple fully automated FOX-XP™ WLBI systems, together with Aehr’s proprietary FOX WaferPak™ full-wafer Contactors and integrated FOX WaferPak Auto Aligners™. Each FOX-XP system is configured to test and burn in nine 300 mm wafers simultaneously. Aehr expects to ship the systems over the next six months for installation at the customer’s high-volume manufacturing partner in Taiwan.

“This $22 million follow-on order represents another significant expansion of WLBI capacity by our lead AI processor customer and further validates the use of our FOX-XP platform in high-volume production,” said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. “We are encouraged that the customer’s current production plans contemplate capacity beyond this order and that we continue to engage with additional semiconductor companies and hyperscalers following positive wafer-level benchmark results.

“We believe this growing interest is being driven in part by the increasing value and complexity of advanced AI semiconductor packages. As AI devices incorporate increasingly valuable processors, high-bandwidth memory (HBM), interface logic, and other die in advanced packages, screening for early-life failures before final assembly can deliver significant quality and economic benefits. We believe these trends are expanding the market opportunity for wafer-level burn-in across AI accelerators, CPUs, network processors and other high-performance computing and semiconductor memory devices.”

Aehr’s FOX-XP platform enables high-volume WLBI and test before semiconductor devices are singulated and packaged. Each FOX-XP system can simultaneously burn in and test up to nine 300 mm wafers and can be integrated with Aehr’s FOX WaferPak Auto Aligner for automated operation in high-volume manufacturing environments.

Aehr’s FOX WLBI systems and proprietary WaferPak contactors help identify early-life and latent reliability failures before devices are singulated and incorporated into advanced packages, improving the quality of die entering assembly and reducing the risk of committing high-value HBM, substrates, interposers, and other components to devices that may subsequently fail reliability screening.

The company believes increasing processor performance, power, device value, advanced packaging, and HBM integration may expand the range of AI and high-performance computing applications for which WLBI provides attractive manufacturing economics.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Receives $22 Million Follow-On Order for AI Processor Wafer-Level Burn-In Systems appeared first on Aehr Test Systems.

Aehr Test Systems Expands Silicon Photonics Production Momentum with Follow-On Production Order from Lead Customer

Jway Support — Tue, 04 Aug 2026 11:29:26 +0000

Fremont, CA (August 4, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received a follow-on production order from its lead silicon photonics wafer-level burn-in (WLBI) customer for a fully automated FOX-XP^® multi-wafer production burn-in system to support the continued expansion of the customer’s manufacturing capacity for next-generation silicon photonic integrated circuits.

The AI industry is rapidly transitioning from moving electrons to moving photons, driving a significant expansion in silicon photonics as hyperscale data centers seek higher bandwidth, lower latency, improved power efficiency, and greater scalability. As silicon photonic integrated circuits become increasingly critical to next-generation AI networking, optical switching, co-packaged optics, linear pluggable optics, and chip-to-chip optical I/O architectures, manufacturers are placing greater emphasis on production-scale reliability screening and WLBI to ensure long-term performance while improving manufacturing yields and reducing production costs.

The ordered system is configured with nine independent WaferPak^® test blades, each capable of delivering up to 3,500 watts of power for production burn-in and reliability screening of high-performance silicon photonic integrated circuits used in optical transceivers and emerging chip-to-chip optical I/O applications. The system also includes Aehr’s fully integrated automated wafer-level handling solution, consisting of the FOX-XP multi-wafer production burn-in system, integrated WaferPak Auto Aligner™, robotic wafer handling, and automated wafer loading and unloading, providing a complete high-volume automated WLBI solution.

The system is expected to ship during the first half of calendar 2027.

Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems, commented:

“This production order is another indication that silicon photonics is moving from technology adoption into manufacturing scale-up, and we believe that transition represents a significant long-term growth opportunity for Aehr. The order reflects our lead silicon photonics customer’s continued expansion of manufacturing capacity and represents another important milestone in the industry’s transition toward high-volume production of silicon photonic integrated circuits.

“As AI clusters continue to grow in size and performance, silicon photonics is emerging as a key enabling technology for delivering the bandwidth, power efficiency, and scalability required by next-generation AI infrastructure. What began with optical transceivers is now expanding into optical switching, co-packaged optics, linear pluggable optics, and chip-to-chip optical I/O.

“At the same time, the industry is moving toward more highly-integrated optical architectures that integrate or closely co-package laser sources with silicon photonic integrated circuits. These advances improve performance, reduce system cost, simplify manufacturing, and make device reliability even more critical.

“As silicon photonic devices continue to increase in complexity, power density, and production volumes, we believe WLBI is becoming a foundational manufacturing step for many of these next-generation devices. Identifying latent defects and stabilization of the integrated lasers before packaging improves manufacturing yields, lowers overall production costs, and enables the long-term reliability demanded by hyperscale AI infrastructure.

“Over the past year, we’ve seen a meaningful increase in engagement from silicon photonics companies around the world spanning engineering qualification systems, production capacity planning, and next-generation device roadmaps. These discussions reinforce our belief that the market is approaching an important inflection point.

“As production requirements evolve toward higher power, fully-automated wafer-level manufacturing, and larger production volumes, we believe our FOX-XP platform and integrated automated wafer-level handling solution position Aehr to become the production standard for wafer-level reliability screening of silicon photonic integrated circuits.”

Industry analysts project strong growth for silicon photonics through the remainder of the decade as hyperscale AI infrastructure, cloud computing, high-performance computing, and advanced optical networking continue driving demand for higher bandwidth and lower power interconnect technologies. Emerging applications including co-packaged optics, optical switching, linear pluggable optics, and chip-to-chip optical I/O are expected to further expand the adoption of silicon photonics throughout AI infrastructure. Industry research also points to increasing adoption of integrated and co-packaged laser architectures that improve optical performance, manufacturing scalability, and system efficiency while further increasing the importance of production reliability screening.

Aehr’s FOX-XP multi-wafer production burn-In system performs full WLBI, stability testing, and production screening of semiconductor devices while enabling customers to test multiple wafers simultaneously in a highly automated manufacturing environment. The FOX-XP platform supports silicon photonics, silicon carbide power semiconductors, AI processors, optical devices, and other semiconductor products requiring production burn-in and reliability screening.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems Expands Silicon Photonics Production Momentum with Follow-On Production Order from Lead Customer appeared first on Aehr Test Systems.