The post Aehr Test Systems to Participate in the 10th Annual Lake Street Capital Markets Best Ideas Growth Conference on September 10 appeared first on Aehr Test Systems.

The post Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026 appeared first on Aehr Test Systems.

The post Aehr Test Systems to Participate in the Needham Virtual Semiconductor and SemiCap 1×1 Conference on August 19 appeared first on Aehr Test Systems.

The post Aehr Test Systems to Present at William Blair 46th Annual Growth Stock Conference on June 2 appeared first on Aehr Test Systems.

The post Aehr Test Systems to Participate in the 23rd Annual Craig-Hallum Institutional Investor Conference on May 28 appeared first on Aehr Test Systems.

Fremont, CA (February 19, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced that President and CEO Gayn Erickson and CFO Chris Siu will host meetings with institutional investors at the Susquehanna 15^th Annual Technology Conference taking place at the Lotte New York Palace Hotel in New York on February 26, 2026.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and packaged-part formats. The growing adoption of wafer-level and packaged-part test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information or to schedule a meeting with Aehr management, please contact your Susquehanna representative or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

The post Aehr Test Systems to Participate in the Susquehanna 15th Annual Technology Conference on February 26, 2026 appeared first on Aehr Test Systems.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are also seeing strong traction with AI processors in both wafer-level and packaged-part formats. The growing adoption of wafer-level and packaged-part test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information or to schedule a virtual meeting with Aehr Test management, please contact your Oppenheimer representative, or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

The post Aehr Test Systems to Participate in the 11th Annual Oppenheimer Emerging Growth Conference on February 3, 2026 appeared first on Aehr Test Systems.

You may register to access a live or replay video webcast of the presentation via a link posted to the investor relations section of Aehr’s website at www.aehr.com or by clicking here.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are also seeing strong traction with AI processors in both wafer level and packaged part formats. The growing adoption of wafer level test and packaged part burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information or to schedule a meeting with Aehr management, please contact your Needham representative or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

The post Aehr Test Systems to Present at the 28th Annual Needham Growth Conference on January 13 appeared first on Aehr Test Systems.

“I’m pleased to once again engage with investors and shareholders to discuss Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “This includes the continued strength we are seeing in our wafer-level burn-in business, with multiple leading companies requesting benchmark evaluations for their AI processors since our last earnings call, and increasing demand for our package-level burn-in solutions including both our ultra-high-power Sonoma systems and our lower-power Echo and Tahoe systems. Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are also seeing strong traction with AI processors in both wafer level and packaged part formats. The growing adoption of wafer level test and packaged part burn-in across these markets is a significant growth driver for Aehr Test Systems.”

The presentation material referenced by Aehr Test at the NYC Summit may be accessed on the investor relations page of the Company’s website at www.aehr.com.

About the 14^th Annual NYC Summit

The NYC Summit is collectively hosted and funded by participating companies and features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 15 management teams during the small group meeting sessions, as well as opportunities to meet with management during the breakfast and lunch networking sessions.

Attendance at the NYC Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is December 10, 2025.

RSVP Contacts for 14th Annual NYC Summit 2025

To RSVP for the CEO Investor Summit, please visit the CEO Summit Events website or contact either of the event co-chairs:

Laura J. Guerrant-Oiye                            Claire E. McAdams
Phone: (808) 960-2642                            Phone: (530) 265-9899}
Email: lauraoiye@gmail.com                 Email: claire@headgatepartners.com

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

The post Aehr Test Systems to Participate in 14th Annual NYC Summit appeared first on Aehr Test Systems.

“I once again look forward to engaging with investors and shareholders to discuss Aehr’s innovative wafer-level test and packaged part burn-in solutions that are enabling the next generation of semiconductor devices across diverse markets,” said Mr. Erickson. “This includes our recently announced order from a leading AI processor supplier for a wafer-level burn-in evaluation and correlation program, as well as additional volume production orders from a top hyperscaler for our Sonoma ultra-high-power packaged part burn-in systems. These wins underscore the growing adoption of our solutions and our success in expanding our addressable market within the rapidly growing AI semiconductor space. Aehr provides complete turnkey systems that improve the quality, reliability, and yield of a wide range of semiconductors, including silicon carbide devices for electric vehicles and charging infrastructure, gallium nitride devices for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are also seeing strong momentum with AI processors in both wafer level and packaged part device formats. The growing adoption of wafer level test and packaged part burn-in across these markets is a key growth driver for Aehr Test Systems.”

The presentation material utilized at the CEO Summit will be made available on the investor relations page of the Company’s website at www.aehr.com.

About the 17th Annual CEO Investor Summit 2025
The CEO Investor Summit is held annually each year during the SEMICON West industry trade show. For the first time, SEMICON West and the CEO Investor Summit will take place in downtown Phoenix, Arizona in October 2025. The CEO Investor Summit will take place on Tuesday, October 7th (the first day of SEMICON West) at The Arrogant Butcher restaurant, located adjacent to the Phoenix Convention Center. Event details include:

Attendance at the CEO Investor Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is September 26, 2025.

RSVP Contacts for 17th Annual CEO Investor Summit 2025
To RSVP for the CEO Investor Summit, please visit the CEO Summit Events website or contact either of the event co-chairs:

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and packaged part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power packaged part reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

The post Aehr Test Systems to Participate in 17th Annual CEO Investor Summit 2025 in Phoenix, AZ appeared first on Aehr Test Systems.