Fremont, CA (August 21, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the Jefferies semiconductor, IT Hardware & Communications Technology Conference taking place August 24-25, 2026 at the Four Seasons Hotel in Chicago. President and CEO Gayn Erickson and CFO Chris Siu will be hosting meetings with investors throughout the day on Tuesday, August 25.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information or to schedule a meeting with Aehr management, please contact your Jefferies representative or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

 

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

 

Fremont, CA (August 13, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the 7^th Annual Needham Virtual Semiconductor and SemiCap 1×1 Conference on Wednesday, August 19, 2026. Aehr Test President and CEO Gayn Erickson and CFO Chris Siu will be hosting virtual meetings with investors throughout the day.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon photonics for data centers, 5G infrastructure and optical input/output (I/O), silicon carbide devices in electric vehicles and charging infrastructure, and gallium nitride for advanced power conversion. We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information, or to schedule a meeting with Aehr management, please contact your Needham representative, or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

 

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

 

Lead AI processor customer expands production capacity as Aehr sees increasing interest in wafer-level burn-in for advanced AI and high-performance computing devices 

FREMONT, CA (August 12, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced a $22 million follow-on production order from its lead wafer-level AI processor customer. The customer is a leading provider of advanced AI training and inference processors.

The order supports the customer’s continued expansion of production capacity utilizing Aehr’s wafer-level burn-in (WLBI) systems and includes multiple fully automated FOX-XP™ WLBI systems, together with Aehr’s proprietary FOX WaferPak™ full-wafer Contactors and integrated FOX WaferPak Auto Aligners™. Each FOX-XP system is configured to test and burn in nine 300 mm wafers simultaneously. Aehr expects to ship the systems over the next six months for installation at the customer’s high-volume manufacturing partner in Taiwan.

“This $22 million follow-on order represents another significant expansion of WLBI capacity by our lead AI processor customer and further validates the use of our FOX-XP platform in high-volume production,” said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. “We are encouraged that the customer’s current production plans contemplate capacity beyond this order and that we continue to engage with additional semiconductor companies and hyperscalers following positive wafer-level benchmark results.

“We believe this growing interest is being driven in part by the increasing value and complexity of advanced AI semiconductor packages. As AI devices incorporate increasingly valuable processors, high-bandwidth memory (HBM), interface logic, and other die in advanced packages, screening for early-life failures before final assembly can deliver significant quality and economic benefits. We believe these trends are expanding the market opportunity for wafer-level burn-in across AI accelerators, CPUs, network processors and other high-performance computing and semiconductor memory devices.”

Aehr’s FOX-XP platform enables high-volume WLBI and test before semiconductor devices are singulated and packaged. Each FOX-XP system can simultaneously burn in and test up to nine 300 mm wafers and can be integrated with Aehr’s FOX WaferPak Auto Aligner for automated operation in high-volume manufacturing environments.

Aehr’s FOX WLBI systems and proprietary WaferPak contactors help identify early-life and latent reliability failures before devices are singulated and incorporated into advanced packages, improving the quality of die entering assembly and reducing the risk of committing high-value HBM, substrates, interposers, and other components to devices that may subsequently fail reliability screening.

The company believes increasing processor performance, power, device value, advanced packaging, and HBM integration may expand the range of AI and high-performance computing applications for which WLBI provides attractive manufacturing economics. 

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; Aehr’s ability to receive orders and generate revenue in the future, as well as Aehr’s beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr’s ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

 

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

 

Fremont, CA (August 4, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received a follow-on production order from its lead silicon photonics wafer-level burn-in (WLBI) customer for a fully automated FOX-XP^® multi-wafer production burn-in system to support the continued expansion of the customer’s manufacturing capacity for next-generation silicon photonic integrated circuits.

The AI industry is rapidly transitioning from moving electrons to moving photons, driving a significant expansion in silicon photonics as hyperscale data centers seek higher bandwidth, lower latency, improved power efficiency, and greater scalability. As silicon photonic integrated circuits become increasingly critical to next-generation AI networking, optical switching, co-packaged optics, linear pluggable optics, and chip-to-chip optical I/O architectures, manufacturers are placing greater emphasis on production-scale reliability screening and WLBI to ensure long-term performance while improving manufacturing yields and reducing production costs.

The ordered system is configured with nine independent WaferPak^® test blades, each capable of delivering up to 3,500 watts of power for production burn-in and reliability screening of high-performance silicon photonic integrated circuits used in optical transceivers and emerging chip-to-chip optical I/O applications. The system also includes Aehr’s fully integrated automated wafer-level handling solution, consisting of the FOX-XP multi-wafer production burn-in system, integrated WaferPak Auto Aligner™, robotic wafer handling, and automated wafer loading and unloading, providing a complete high-volume automated WLBI solution.

The system is expected to ship during the first half of calendar 2027.

Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems, commented: 

“This production order is another indication that silicon photonics is moving from technology adoption into manufacturing scale-up, and we believe that transition represents a significant long-term growth opportunity for Aehr. The order reflects our lead silicon photonics customer’s continued expansion of manufacturing capacity and represents another important milestone in the industry’s transition toward high-volume production of silicon photonic integrated circuits.

“As AI clusters continue to grow in size and performance, silicon photonics is emerging as a key enabling technology for delivering the bandwidth, power efficiency, and scalability required by next-generation AI infrastructure. What began with optical transceivers is now expanding into optical switching, co-packaged optics, linear pluggable optics, and chip-to-chip optical I/O.

“At the same time, the industry is moving toward more highly-integrated optical architectures that integrate or closely co-package laser sources with silicon photonic integrated circuits. These advances improve performance, reduce system cost, simplify manufacturing, and make device reliability even more critical.

“As silicon photonic devices continue to increase in complexity, power density, and production volumes, we believe WLBI is becoming a foundational manufacturing step for many of these next-generation devices. Identifying latent defects and stabilization of the integrated lasers before packaging improves manufacturing yields, lowers overall production costs, and enables the long-term reliability demanded by hyperscale AI infrastructure.

“Over the past year, we’ve seen a meaningful increase in engagement from silicon photonics companies around the world spanning engineering qualification systems, production capacity planning, and next-generation device roadmaps. These discussions reinforce our belief that the market is approaching an important inflection point.

“As production requirements evolve toward higher power, fully-automated wafer-level manufacturing, and larger production volumes, we believe our FOX-XP platform and integrated automated wafer-level handling solution position Aehr to become the production standard for wafer-level reliability screening of silicon photonic integrated circuits.”

Industry analysts project strong growth for silicon photonics through the remainder of the decade as hyperscale AI infrastructure, cloud computing, high-performance computing, and advanced optical networking continue driving demand for higher bandwidth and lower power interconnect technologies. Emerging applications including co-packaged optics, optical switching, linear pluggable optics, and chip-to-chip optical I/O are expected to further expand the adoption of silicon photonics throughout AI infrastructure. Industry research also points to increasing adoption of integrated and co-packaged laser architectures that improve optical performance, manufacturing scalability, and system efficiency while further increasing the importance of production reliability screening.

Aehr’s FOX-XP multi-wafer production burn-In system performs full WLBI, stability testing, and production screening of semiconductor devices while enabling customers to test multiple wafers simultaneously in a highly automated manufacturing environment. The FOX-XP platform supports silicon photonics, silicon carbide power semiconductors, AI processors, optical devices, and other semiconductor products requiring production burn-in and reliability screening.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; Aehr’s ability to receive orders and generate revenue in the future, as well as Aehr’s beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr’s ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

 

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

 

Fremont, CA (July 9, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received an additional follow-on production order from its lead silicon photonics customer for a fully automated FOX-XP^® wafer-level burn-in (WLBI) system. The system will support high-volume production burn-in of silicon photonics devices used in AI optical interconnect and hyperscale data center applications.

The order includes Aehr’s turnkey FOX-XP multi-wafer WLBI system configured to test up to nine 300mm wafers in parallel together with the fully automated FOX WaferPak^® AutoAligner™, enabling automated, high-volume production burn-in with hands-free operation when integrated with an automated wafer handler.

The customer is developing advanced silicon photonics devices used in next-generation optical interconnects and optical I/O architectures for hyperscale AI and cloud data centers and advanced packaging of AI processors and high-performance computing (HPC) devices. These silicon photonics devices enable dramatically higher bandwidth and lower power communication between AI processors, memory, switches, and networking equipment, addressing one of the industry’s most significant bottlenecks as AI infrastructure continues to scale. Industry leaders across the AI ecosystem have increasingly identified silicon photonics and optical I/O as key enabling technologies for future AI clusters, rack-scale computing, and chip-to-chip communications to permanently replace copper interconnects that are approaching their practical performance and power limits.

This customer took delivery of its first FOX-XP with fully automated WaferPak Aligner production system in fiscal 2026. The system has now been successfully installed and demonstrated fully automated, hands-free operation integrated with the customer’s automated wafer handling equipment and an automated guided vehicle for 300mm wafer FOUP movement. This represents an important production milestone as the customer ramps up manufacturing of its silicon photonics products.

“The successful installation and production qualification of our first fully-automated system with this customer represents another important milestone in our long-term relationship with them,” said Gayn Erickson, President and CEO of Aehr Test Systems. “Demonstrating fully hands-free production operation with our integrated FOX-XP platform and automated wafer handling validates not only our technology, but also our ability to support customers as they transition from engineering qualification into high-volume manufacturing.

“We are very pleased to receive this additional follow-on production order early in our new fiscal year. We believe this order reflects the customer’s continued confidence in Aehr’s FOX-XP platform and represents an encouraging start to fiscal 2027. As AI infrastructure evolves toward optical interconnects and optical I/O, we believe Aehr is well-positioned to support customers that require cost-effective, high-throughput WLBI and stabilization.”

Demand for silicon photonics continues to accelerate as hyperscale AI infrastructure expands. Major technology companies and AI infrastructure providers are increasingly adopting optical interconnect technologies to overcome the bandwidth, latency, and power limitations of traditional electrical interconnects. Industry forecasts anticipate significant growth in silicon photonics deployments over the coming years as optical communication moves closer to AI processors and ultimately onto processor packages through optical I/O architectures.

Aehr’s FOX-XP platform is designed for high-power wafer-level test and burn-in of advanced semiconductor devices, including silicon photonics integrated circuits, AI processors, power semiconductors, memory devices, sensors, and other leading-edge semiconductor technologies. The FOX-XP system enables parallel burn-in and test of up to nine wafers simultaneously and, when combined with the FOX WaferPak AutoAligner, provides a fully automated production solution that significantly reduces handling time while improving throughput, repeatability, and manufacturing efficiency. The platform utilizes Aehr’s proprietary FOX WaferPak Contactors, allowing full-wafer electrical contact and burn-in before singulation to identify infant mortality failures, improve long-term reliability, and lower overall manufacturing costs. 

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; Aehr’s ability to receive orders and generate revenue in the future, as well as Aehr’s beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr’s ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

 

Fremont, CA (June 17, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received a follow-on production order for a fully automated FOX-XP™ wafer-level burn-in (WLBI) system. The system is configured to test nine wafers in parallel, and includes a fully integrated WaferPak™ Auto Aligner, and a full set of FOX WaferPak Contactors. The system is scheduled for delivery within the next six months.

This customer is a global leader in networking products and solutions and a major supplier to the data center optical transceiver market. The customer is developing advanced silicon photonics–based transceivers for data center networking and optical I/O applications to address the rapidly accelerating demand for high-speed fiber optic communication links in hyperscale AI and cloud data centers. The customer has also provided Aehr with a forecast for additional systems this calendar year as it ramps capacity to support next generation hyperscale data center deployments.

“We are excited to receive this follow-on order for a full production FOX WLBI test cell, which reflects the urgency of the production ramp now underway to support the massive buildout of hyperscale AI and cloud data centers,” said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. “This customer is a leading supplier of networking products and solutions for the data center market, and we are pleased to support its capacity expansion plans as it prepares for next-generation hyperscale data center deployments.

“We first engaged with this customer only seven months ago with an objective to move quickly to volume production within six months. Aehr was able to demonstrate the production-ready capabilities of our fully integrated test cell to meet the customer’s performance and throughput requirements in a remarkably short period of time. This enabled us to deliver a full production system and two engineering systems to them by May, meeting their goal. By leveraging our FOX wafer-level systems installed base, which has now been deployed to more than 25 customers, we believe we are well positioned to help customers move efficiently from qualification to production in a very short period.

“Data center architectures are rapidly evolving as AI infrastructure scales, driving a major transition from traditional copper interconnects to fiber optic communication links to meet the increasing requirements for bandwidth, latency, signal integrity, thermal performance, and power efficiency. Silicon photonics-based optical transceivers are a critical enabling technology for this transformation. We believe Aehr is well positioned to participate in what could be a significant multiyear expansion of silicon photonics production driven by the growth of fiber optic interconnects in hyperscale AI data centers.

“This customer engagement further validates wafer-level burn-in as an increasingly important part of silicon photonics manufacturing flow and highlights the potential for silicon photonics to become a meaningful long-term growth driver for Aehr’s WLBI business. With our leadership in WLBI for silicon photonics and our ability to support customers for qualification through high-volume production, we believe Aehr offers the industry’s most cost-effective solution for this rapidly emerging market.”

As data center architectures scale to support AI, cloud computing, and high-performance networking, fiber optic interconnects offer significant advantages over copper wiring, including higher data rates, lower power consumption, longer reach, improved thermal performance, and reduced electromagnetic interference. These advantages are driving rapid adoption of silicon photonics transceivers across hyperscale and enterprise data centers worldwide and increasing demand for cost-effective, production-proven burn-in solutions that can ensure device quality and long-term reliability at volume.

Aehr is the market leader in WLBI for silicon photonics transceivers, with a large installed base at leading global semiconductor and photonics companies. The Company’s FOX-XP platform enables high-parallelism, high-temperature, and high-power WLBI, with the unique ability to precisely maintain devices at the required temperature to enable highly effective burn-in, allowing customers to identify early-life failures before packaging while significantly reducing cost of test.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; Aehr’s ability to receive orders and generate revenue in the future, as well as Aehr’s beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr’s ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

 

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com