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Aehr Test Systems to Announce First Quarter Fiscal 2027 Financial Results on November 2, 2026

Paul Sevilla — Thu, 08 Oct 2026 11:30:37 +0000

Fremont, CA (October 8, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will report financial results for its first quarter of fiscal 2027 ended September 25, 2026 on Monday, November 2, 2026 following the close of the market. The Company will host a conference call and webcast at 5:00 p.m. Eastern time to discuss the results.

As previously announced, Aehr changed its fiscal year end from May to June, shifting its quarterly reporting calendar. The company’s first quarter of fiscal 2027 began on June 27, 2026 and ended on September 25, 2026. Aehr’s fiscal 2027 ends on June 25, 2027.

What:	Aehr Test Systems first quarter fiscal 2027 financial results.
When:	Monday, November 2, at 5:00 p.m. Eastern Time (2:00 p.m. PT).
Dial in Number:	To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 953740.
Webcast:	To access the live webcast, please visit the investor relations section at www.aehr.com.
Call Replay:	A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 54635.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems to Announce First Quarter Fiscal 2027 Financial Results on November 2, 2026 appeared first on Aehr Test Systems.

Aehr Receives Follow-On Sonoma™ Production Orders for Lead Hyperscale Customer’s Next-Generation AI Processor

Paul Sevilla — Wed, 07 Oct 2026 11:30:24 +0000

Orders supports customer’s second AI processor program on Sonoma, with production expected to ramp in calendar 2027

FREMONT, CA (October 7, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced approximately $6 million in follow-on production orders from its lead hyperscale customer for package-level burn-in (PLBI) of its next-generation AI processor for data center training and inference applications.

The orders include additional Sonoma™ high-power package-level test and burn-in systems, fully turnkey burn-in modules (BIMs) and device-specific sockets, as well as production software enhancements. The systems and consumables will be deployed at one of the customer’s outsourced semiconductor assembly and test (OSAT) partners in Taiwan. Deliveries under the order are scheduled over the next six months.

This next-generation AI processor is the second from this customer to use Aehr’s Sonoma platform for production burn-in. Following the previously announced initial production win, these orders expand the customer’s capacity ahead of an expected production ramp of this second AI device in calendar 2027. The customer has indicated that this second AI processor is expected to ultimately reach production volumes exceeding those of the customer’s first processor brought into production burn-in on the Sonoma platform. That first processor is already in high-volume production, with volumes expected to continue ramping significantly as additional Sonoma system capacity is deployed over the next several months.

“These follow-on production orders demonstrate the continued expansion of our relationship with this hyperscale customer and its confidence in Sonoma to support successive generations of increasingly powerful and complex AI processors,” said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. “The program is progressing from qualification and initial production systems to additional systems, consumables and software supporting the anticipated production ramp. As volumes increase, we believe there is potential for significant additional demand for Sonoma systems and device-specific consumables.”

The next-generation processor requires independently controlled thermal zones within each package to achieve the operating conditions needed for effective production burn-in and early-life failure screening. Sonoma’s multi-zone thermal control capabilities enable independent temperature management across different areas of a device while delivering the high current required to electrically stress the processor.

The platform also supports independent electrical test vectors and monitoring of multiple devices or functional elements within a multi-chip package. These capabilities address the differing power densities and thermal characteristics of advanced AI packages, which increasingly combine compute die, high-bandwidth memory and interface components.

“As AI processors become more complex, controlling the temperature of the package as a whole is no longer sufficient for some applications,” Erickson continued. “Sonoma’s ability to independently manage multiple thermal zones and electrical test functions helps customers address these challenges. We believe these capabilities will become increasingly important as AI packages continue to grow in power, size, complexity and value.”

Aehr is also engaged in detailed discussions with this customer regarding reliability qualification and production burn-in requirements for future generations of higher-power, larger AI devices. These discussions include both Aehr’s Sonoma package-level and FOX-XP™ wafer -level burn-in (WLBI) platforms.

“As the value of advanced AI packages increases, identifying early-life failures before expensive packaging can deliver significant economic benefits,” Erickson added. “WLBI can screen die before assembly, while PLBI can stress and screen the completed device. Customers may choose either approach or use both at different stages of qualification and production, depending on their requirements.”

“Our ability to support both approaches positions Aehr well as customers develop reliability strategies for future AI processors. With Sonoma supporting this customer’s first processor in high-volume production and now its next-generation program, we are building a foundation for continued growth as the customer’s AI roadmap advances.”

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced artificial intelligence (AI) processors, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; Aehr’s ability to receive orders and generate revenue in the future, as well as Aehr’s beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr’s ability to integrate Incal efficiently; and the timing and extent to which the acquisition is accretive. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

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Aehr Test Systems to Participate in 18th Annual CEO Investor Summit 2026 in San Francisco

Paul Sevilla — Mon, 28 Sep 2026 11:30:28 +0000

Fremont, CA (September 28, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that President and CEO Gayn Erickson and CFO Chris Siu will be participating in the 18th Annual CEO Investor Summit being held Tuesday, October 13^th at the St. Regis Hotel, San Francisco, CA.

“We once again look forward to participating in this annual event and discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

The presentation material referenced by Aehr Test at the CEO Summit may be accessed on the investor relations page of the Company’s website at www.aehr.com.

About the 18^th Annual CEO Investor Summit 2026

The CEO Investor Summit is held annually each year during the SEMICON West industry trade show. Collectively hosted and funded by participating companies, the CEO Investor Summit features a “round-robin” format consisting of small group meetings with company management teams. During the event, investors and analysts will have the opportunity to meet with the majority of the 11 management teams during the small group meeting sessions and networking events.

Attendance at the CEO Investor Summit is by invitation only and is available solely to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is October 2, 2026.

RSVP Contacts for 18^th Annual CEO Investor Summit 2026

To RSVP for the CEO Investor Summit, please visit the CEO Summit Events website or contact either of the event co-chairs:

Laura J. Guerrant-Oiye
Phone: (808) 960-2642
Email: lauraoiye@gmail.com

Claire E. McAdams
Phone: (530) 265-9899
Email: claire@headgatepartners.com

About Aehr Test Systems

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	MKR Investor Relations Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact aehr@mkr-group.com

The post Aehr Test Systems to Participate in 18th Annual CEO Investor Summit 2026 in San Francisco appeared first on Aehr Test Systems.

Aehr Test Systems to Participate in the 10th Annual Lake Street Capital Markets Best Ideas Growth Conference on September 10

Jway Support — Thu, 03 Sep 2026 20:05:02 +0000

Fremont, CA (September 3, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that President and CEO Gayn Erickson and CFO Chris Siu will be participating in meetings with institutional investors at the Lake Street Capital Markets 10^th Annual Best Ideas Growth Conference taking place Thursday, September 10, 2026 at the Metropolitan Club in New York City.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon carbide devices in electric vehicles and charging infrastructure, gallium nitride for advanced power conversion, and silicon photonics for data centers, 5G infrastructure and optical input/output (I/O). We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information or to schedule a meeting with Aehr management, please contact your Lake Street Capital Markets representative or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems to Participate in the 10th Annual Lake Street Capital Markets Best Ideas Growth Conference on September 10 appeared first on Aehr Test Systems.

Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026

Jway Support — Sun, 23 Aug 2026 11:30:14 +0000

Fremont, CA (August 21, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the Jefferies semiconductor, IT Hardware & Communications Technology Conference taking place August 24-25, 2026 at the Four Seasons Hotel in Chicago. President and CEO Gayn Erickson and CFO Chris Siu will be hosting meetings with investors throughout the day on Tuesday, August 25.

For additional information or to schedule a meeting with Aehr management, please contact your Jefferies representative or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems to Participate in the Jefferies Semiconductor, IT Hardware & Communications Technology Conference on August 25, 2026 appeared first on Aehr Test Systems.

Aehr Test Systems to Participate in the Needham Virtual Semiconductor and SemiCap 1×1 Conference on August 19

Jway Support — Thu, 13 Aug 2026 11:28:33 +0000

Fremont, CA (August 13, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced that it will participate in the 7^th Annual Needham Virtual Semiconductor and SemiCap 1×1 Conference on Wednesday, August 19, 2026. Aehr Test President and CEO Gayn Erickson and CFO Chris Siu will be hosting virtual meetings with investors throughout the day.

“We look forward to discussing with investors and shareholders Aehr’s expanding role in enabling the next generation of semiconductor devices across a wide range of markets,” said Mr. Erickson. “Aehr delivers complete turnkey solutions that improve the quality, reliability, and yield of semiconductors used in critical applications, including AI processors in cloud computing and data centers, silicon photonics for data centers, 5G infrastructure and optical input/output (I/O), silicon carbide devices in electric vehicles and charging infrastructure, and gallium nitride for advanced power conversion. We are seeing strong traction with AI processors in both wafer-level and package-level formats. The growing adoption of wafer-level and package-level test and burn-in across these markets is expected to be a significant growth driver for Aehr Test Systems.”

For additional information, or to schedule a meeting with Aehr management, please contact your Needham representative, or Aehr’s investor relations firm, PondelWilkinson, Inc., at jbyers@pondel.com.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems to Participate in the Needham Virtual Semiconductor and SemiCap 1×1 Conference on August 19 appeared first on Aehr Test Systems.

Aehr Receives $22 Million Follow-On Order for AI Processor Wafer-Level Burn-In Systems

Jway Support — Wed, 12 Aug 2026 11:28:14 +0000

Lead AI processor customer expands production capacity as Aehr sees increasing interest in wafer-level burn-in for advanced AI and high-performance computing devices

FREMONT, CA (August 12, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced a $22 million follow-on production order from its lead wafer-level AI processor customer. The customer is a leading provider of advanced AI training and inference processors.

The order supports the customer’s continued expansion of production capacity utilizing Aehr’s wafer-level burn-in (WLBI) systems and includes multiple fully automated FOX-XP™ WLBI systems, together with Aehr’s proprietary FOX WaferPak™ full-wafer Contactors and integrated FOX WaferPak Auto Aligners™. Each FOX-XP system is configured to test and burn in nine 300 mm wafers simultaneously. Aehr expects to ship the systems over the next six months for installation at the customer’s high-volume manufacturing partner in Taiwan.

“This $22 million follow-on order represents another significant expansion of WLBI capacity by our lead AI processor customer and further validates the use of our FOX-XP platform in high-volume production,” said Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems. “We are encouraged that the customer’s current production plans contemplate capacity beyond this order and that we continue to engage with additional semiconductor companies and hyperscalers following positive wafer-level benchmark results.

“We believe this growing interest is being driven in part by the increasing value and complexity of advanced AI semiconductor packages. As AI devices incorporate increasingly valuable processors, high-bandwidth memory (HBM), interface logic, and other die in advanced packages, screening for early-life failures before final assembly can deliver significant quality and economic benefits. We believe these trends are expanding the market opportunity for wafer-level burn-in across AI accelerators, CPUs, network processors and other high-performance computing and semiconductor memory devices.”

Aehr’s FOX-XP platform enables high-volume WLBI and test before semiconductor devices are singulated and packaged. Each FOX-XP system can simultaneously burn in and test up to nine 300 mm wafers and can be integrated with Aehr’s FOX WaferPak Auto Aligner for automated operation in high-volume manufacturing environments.

Aehr’s FOX WLBI systems and proprietary WaferPak contactors help identify early-life and latent reliability failures before devices are singulated and incorporated into advanced packages, improving the quality of die entering assembly and reducing the risk of committing high-value HBM, substrates, interposers, and other components to devices that may subsequently fail reliability screening.

The company believes increasing processor performance, power, device value, advanced packaging, and HBM integration may expand the range of AI and high-performance computing applications for which WLBI provides attractive manufacturing economics.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Receives $22 Million Follow-On Order for AI Processor Wafer-Level Burn-In Systems appeared first on Aehr Test Systems.

Aehr Test Systems Expands Silicon Photonics Production Momentum with Follow-On Production Order from Lead Customer

Jway Support — Tue, 04 Aug 2026 11:29:26 +0000

Fremont, CA (August 4, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received a follow-on production order from its lead silicon photonics wafer-level burn-in (WLBI) customer for a fully automated FOX-XP^® multi-wafer production burn-in system to support the continued expansion of the customer’s manufacturing capacity for next-generation silicon photonic integrated circuits.

The AI industry is rapidly transitioning from moving electrons to moving photons, driving a significant expansion in silicon photonics as hyperscale data centers seek higher bandwidth, lower latency, improved power efficiency, and greater scalability. As silicon photonic integrated circuits become increasingly critical to next-generation AI networking, optical switching, co-packaged optics, linear pluggable optics, and chip-to-chip optical I/O architectures, manufacturers are placing greater emphasis on production-scale reliability screening and WLBI to ensure long-term performance while improving manufacturing yields and reducing production costs.

The ordered system is configured with nine independent WaferPak^® test blades, each capable of delivering up to 3,500 watts of power for production burn-in and reliability screening of high-performance silicon photonic integrated circuits used in optical transceivers and emerging chip-to-chip optical I/O applications. The system also includes Aehr’s fully integrated automated wafer-level handling solution, consisting of the FOX-XP multi-wafer production burn-in system, integrated WaferPak Auto Aligner™, robotic wafer handling, and automated wafer loading and unloading, providing a complete high-volume automated WLBI solution.

The system is expected to ship during the first half of calendar 2027.

Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems, commented:

“This production order is another indication that silicon photonics is moving from technology adoption into manufacturing scale-up, and we believe that transition represents a significant long-term growth opportunity for Aehr. The order reflects our lead silicon photonics customer’s continued expansion of manufacturing capacity and represents another important milestone in the industry’s transition toward high-volume production of silicon photonic integrated circuits.

“As AI clusters continue to grow in size and performance, silicon photonics is emerging as a key enabling technology for delivering the bandwidth, power efficiency, and scalability required by next-generation AI infrastructure. What began with optical transceivers is now expanding into optical switching, co-packaged optics, linear pluggable optics, and chip-to-chip optical I/O.

“At the same time, the industry is moving toward more highly-integrated optical architectures that integrate or closely co-package laser sources with silicon photonic integrated circuits. These advances improve performance, reduce system cost, simplify manufacturing, and make device reliability even more critical.

“As silicon photonic devices continue to increase in complexity, power density, and production volumes, we believe WLBI is becoming a foundational manufacturing step for many of these next-generation devices. Identifying latent defects and stabilization of the integrated lasers before packaging improves manufacturing yields, lowers overall production costs, and enables the long-term reliability demanded by hyperscale AI infrastructure.

“Over the past year, we’ve seen a meaningful increase in engagement from silicon photonics companies around the world spanning engineering qualification systems, production capacity planning, and next-generation device roadmaps. These discussions reinforce our belief that the market is approaching an important inflection point.

“As production requirements evolve toward higher power, fully-automated wafer-level manufacturing, and larger production volumes, we believe our FOX-XP platform and integrated automated wafer-level handling solution position Aehr to become the production standard for wafer-level reliability screening of silicon photonic integrated circuits.”

Industry analysts project strong growth for silicon photonics through the remainder of the decade as hyperscale AI infrastructure, cloud computing, high-performance computing, and advanced optical networking continue driving demand for higher bandwidth and lower power interconnect technologies. Emerging applications including co-packaged optics, optical switching, linear pluggable optics, and chip-to-chip optical I/O are expected to further expand the adoption of silicon photonics throughout AI infrastructure. Industry research also points to increasing adoption of integrated and co-packaged laser architectures that improve optical performance, manufacturing scalability, and system efficiency while further increasing the importance of production reliability screening.

Aehr’s FOX-XP multi-wafer production burn-In system performs full WLBI, stability testing, and production screening of semiconductor devices while enabling customers to test multiple wafers simultaneously in a highly automated manufacturing environment. The FOX-XP platform supports silicon photonics, silicon carbide power semiconductors, AI processors, optical devices, and other semiconductor products requiring production burn-in and reliability screening.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems Expands Silicon Photonics Production Momentum with Follow-On Production Order from Lead Customer appeared first on Aehr Test Systems.

Aehr Test Systems Reports Fiscal 2026 Fourth Quarter and Full Year Financial Results with Record Quarterly Bookings and $100 Million Effective Backlog

Jway Support — Tue, 14 Jul 2026 20:44:43 +0000

Record quarterly bookings and effective backlog provide substantial visibility into projected fiscal 2027 revenue of $130 million to $150 million, representing 2.6x to 3.0x fiscal 2026 revenue

Fremont, CA (July 14, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced financial results for its fiscal 2026 fourth quarter and full year ended May 29, 2026.

Fiscal Fourth Quarter Financial Results:

Net revenue was $18.8 million, compared to $14.1 million in the fourth quarter of fiscal 2025.
GAAP net income was $1.4 million, or $0.04 per diluted share, compared to GAAP net loss of $(2.9) million, or $(0.10) per diluted share, in the fourth quarter of fiscal 2025.
Non-GAAP net income, which excludes stock-based compensation and acquisition-related adjustments, was $3.6 million, or $0.11 per diluted share, compared to non-GAAP net loss of $(0.2) million, or $(0.01) per diluted share, in the fourth quarter of fiscal 2025.
Bookings were a record $60.7 million for the quarter.
Backlog as of May 29, 2026 was $80.6 million. Effective backlog, including bookings since May 29, 2026, is $100.6 million.
Total cash, cash equivalents and restricted cash as of May 29, 2026 was $116.5 million, compared to $37.1 million on February 27, 2026.

Fiscal Year Financial Results:

Net revenue was $50.0 million, compared to $59.0 million in fiscal 2025.
GAAP net loss was $(7.1) million, or $(0.23) per diluted share, compared to GAAP net loss of $(3.9) million, or $(0.13) per diluted share, in fiscal 2025.
Non-GAAP net income was $0.9 million, or $0.03 per diluted share, which excludes stock-based compensation, acquisition-related adjustments and restructuring charges, compared to non-GAAP net income of $4.6 million, or $0.15 per diluted share, in fiscal 2025.
Cash used in operating activities was $3.3 million for fiscal 2026.

An explanation of the use of non-GAAP financial measures and a reconciliation of Aehr’s non-GAAP financial measures to the most directly comparable GAAP financial measures can be found in the accompanying tables.

Gayn Erickson, President and CEO of Aehr Test Systems, commented:

“We are very pleased with our fiscal fourth quarter performance, which exceeded expectations and capped a year of significant bookings and revenue diversification for Aehr. Record quarterly bookings, a very strong backlog, and growing demand across AI processors, silicon photonics, and power semiconductors for our wafer-level and package-level burn-in solutions position us well for significant growth moving forward.

“With strong momentum and a record backlog of over $100 million heading into fiscal year 2027, we have substantial visibility into projected fiscal 2027 revenue of $130 million to $150 million, representing expected year-over-year growth of approximately 160% to 200%. This outlook is based on the information available to us today, including our current backlog and anticipated customer demand. We continue to pursue additional orders from existing and prospective customers.

“In wafer-level burn-in (WLBI), demand from AI-related applications continued to accelerate. Our lead AI production customer is significantly ramping capacity, driving an increase in forecasted capacity needs for our FOX WLBI solutions this year and beyond. They are shifting their burn-in from system-level to all wafer-level for their AI accelerators used for training and inference applications. We are also engaged with additional AI processor suppliers that are evaluating WLBI to improve product reliability and reduce yield loss from production burn-in of their devices later in the manufacturing process.

“We are excited to report that we successfully completed benchmark testing of our WLBI solution with a major supplier of AI accelerators, CPUs, and network processors. The testing was conducted on one of their processors and produced results that exceeded their expectations. This top-tier AI processor supplier has now expressed interest in moving to pilot production test validation for its current high-volume device, for which we completed the benchmark. They indicated that this device is expected to continue ramping and achieve significant volumes over the next year or more. In addition, they recently requested that we evaluate a second device in parallel. The potential revenue opportunity from any one of these devices is significant to Aehr in terms of near and long-term revenue streams related to the WLBI systems and proprietary Aehr WaferPak contactors.

“Our package-level burn-in business for AI processors also gained momentum in the year, highlighted by record follow-on production orders from our lead hyperscale customer for Sonoma systems supporting high-volume AI processor production burn-in. This customer is a premier large-scale data center provider and is forecasting a substantial expansion of Sonoma system purchases for a second device which has twice the power per package as the first device that they are using Sonoma systems for today. As their current and next-generation devices ramp, we believe Sonoma systems and consumables can become an increasingly important contributor to Aehr’s revenue. We are also engaged with multiple current and potential new customers for package-level reliability qualification and production burn-in of AI accelerators, Application-Specific Integrated Circuits (ASICs), network processors, and also for edge AI processors for automotive and robotics, which represent significant opportunities for Aehr over the next few years.

“As we have anticipated for the last year, silicon photonics devices and the need for production burn-in is now seeing strong momentum as AI data center architectures increasingly rely on optical I/O and high-speed interconnects. Our lead silicon photonics customer is ramping, with follow-on orders this past year and more already in this fiscal year for fully automated WLBI systems powering AI optical I/O and data center interconnects. In addition, our newest major silicon photonics customer that is a global leader in networking products and solutions has provided us a forecast for additional systems this calendar year as it ramps capacity to support next-generation hyperscale data center deployments. We believe the silicon photonics and optical test and burn-in market has the potential to grow substantially and could be another long-term growth driver for Aehr.

“We are seeing encouraging signs of recovery in silicon carbide (SiC) power semiconductors. We are actively engaged to meet the WLBI needs of several of the world’s largest automotive manufacturers and several of their SiC suppliers for their new electric vehicles. We also announced today that we received approximately $8 million in new orders in just the last month for silicon carbide WLBI WaferPaks as global electric vehicle programs accelerate. These include expanded production orders from our lead silicon carbide customer for WaferPak full wafer contactors, and a key order directly from one of the largest automotive companies in the world for multiple WaferPaks to be used in qualification of silicon carbide devices from suppliers for their new generation of electric vehicles using Aehr’s FOX WLBI systems.This year, we expect renewed demand for both SiC and GaN power semiconductor test and burn-in, driven by automotive electrification and AI data center power infrastructure.

“We also continue to pursue opportunities in memory, including NAND flash and potential high bandwidth memory (HBM) applications with our WLBI solutions roadmap. The growth of these two memory markets may have never been stronger, with massive capacity increases planned this decade. We continue to work with multiple memory suppliers to align our solutions to meet the production needs of these companies’ new capacity coming online.

“Looking ahead, we are very excited about our position entering fiscal 2027. With multiple customers entering or expanding production, a record backlog, and additional opportunities under discussion for both wafer-level and package-level burn-in, we believe Aehr is well positioned for multiple years of strong revenue growth.”

Financial Guidance:

For the fiscal year ending June 25, 2027, Aehr expects total company revenue to be between $130 million and $150 million, representing approximately 160%-200% year-over-year growth. Aehr also expects non-GAAP net income to be 18% to 22% of total revenue. This outlook reflects the company’s current effective backlog of approximately $100 million and expected customer demand from existing production programs. Aehr continues to pursue additional orders from current and prospective customers.

Management Conference Call and Webcast:

Aehr Test Systems will host a conference call and webcast today at 5:00 p.m. Eastern (2:00 p.m. Pacific) to discuss its fiscal 2026 fourth quarter and full year operating results. To access the live call, dial +1 888-506-0062 (US and Canada) or +1 973-528-0011 (International) and give the participant passcode 222496. In addition, a live and archived webcast of the conference call will be available over the Internet at www.aehr.com in the Investor Relations section and may also be accessed by clicking here. A phone replay of the call will be available approximately two hours following the end of the live call and will remain available for one week. To access the call replay, dial +1 877-481-4010 (US and Canada) or +1 919-882-2331 (International) and enter replay passcode 54119.

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future bookings, benchmark evaluations and product development from Aehr’s new and existing customers; future applications and orders for the AI processors, test solutions for AI semiconductor manufacturers and the Sonoma system; revenue and revenue growth forecasted; financial performance and bookings forecasted; financial guidance for the full fiscal year 2027; expectations regarding current and future partnerships; expectations regarding industry demand and emerging technologies as a whole and smaller segments within it; and the ability for Aehr to successfully enter new markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

Represents compensation expense for equity awards granted to employees and directors.
Represents amortization of acquired intangible assets and accretion expense of escrow payable.
Represents restructuring charges, primarily related to a lease early termination, along with employee termination benefits from a separate restructuring initiative.
Represents severance benefits, including compensation expense, provided due to the passing of an officer as per the terms of his change in control and severance agreement
Represents acquisition activity costs.

Non-GAAP measures should not be considered a replacement for GAAP results. The non-GAAP measures indicated above are financial measures the Company uses to evaluate the underlying results and operating performance of the business. The limitation of these measures are that they exclude items that impact the Company’s current period GAAP measures. This limitation is best addressed by using these measures in combination with the most directly comparable GAAP financial measures. These measures are not in accordance with GAAP and may differ from non-GAAP methods of accounting and reporting used by other companies.

We believe these measures enhance investors’ ability to review the Company’s business from the same perspective as the Company’s management and facilitate comparisons of this period’s results with prior periods.

(1) Includes restricted cash within prepaid expenses and other current assets and other non-current assets.

Contacts:
Aehr Test Systems Chris Siu Chief Financial Officer csiu@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Test Systems Reports Fiscal 2026 Fourth Quarter and Full Year Financial Results with Record Quarterly Bookings and $100 Million Effective Backlog appeared first on Aehr Test Systems.

Aehr Receives More Than $8 Million in New Silicon Carbide Wafer-Level Burn-In Orders as Global Electric Vehicle Programs Accelerate

Jway Support — Tue, 14 Jul 2026 20:33:53 +0000

Expanded Production Orders from Lead Silicon Carbide Customer, and Growing Engagement with Leading Automotive Suppliers Highlight Strengthening Silicon Carbide Market

Fremont, CA (July 14, 2026) – Aehr Test Systems (NASDAQ: AEHR), a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), silicon photonics, data center, automotive, and industrial applications, today announced it has received more than $8 million in new silicon carbide wafer-level burn-in (WLBI) orders.

The orders include a significant follow-on order for additional FOX WaferPak™ full wafer Contactors from its lead silicon carbide production customer to support expanded manufacturing capacity for new electric vehicle platforms, particularly those serving the rapidly growing China electric vehicle market. The large WaferPak order reflects increased production activity and utilization at the customer, as demand for silicon carbide power devices continues to improve. In addition to these WaferPak orders, the customer indicated additional future capacity requirements beyond this order in Aehr’s current fiscal year. Aehr also received a key order directly from one of the largest automotive companies in the world for multiple WaferPaks to be used in qualification of silicon carbide devices from suppliers for their new generation of electric vehicles using Aehr’s FOX wafer level burn-in systems.

Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are very pleased to announce these new orders, which we believe reflect strengthening momentum in the power semiconductor WLBI market and the beginning of the next phase of growth for this portion of our business. Our lead silicon carbide production customer continues to expand capacity with additional WaferPak orders supporting new electric vehicle programs, particularly in China where electric vehicle adoption continues to accelerate.

“Perhaps even more encouraging is what we are seeing with the new WaferPak order directly from one of the top two leading automotive companies in the world that is using our FOX systems and proprietary WaferPaks to qualify the quality and reliability of multiple silicon carbide companies around the world for their planned electric vehicle expansions. We are actively engaged with several of the world’s largest automotive companies, and with several leading silicon carbide device manufacturers who are supporting their next-generation electric vehicle platforms as they evaluate deploying WLBI in production. These companies recognize the increasing importance of screening for early-life failures at the wafer level, before packaging, to improve long-term reliability and reduce manufacturing costs. We believe these engagements represent significant future production opportunities for Aehr as WLBI continues to gain acceptance as a critical manufacturing step for high-reliability automotive power semiconductors.

“We also recently secured our first silicon carbide customer in Taiwan last quarter, expanding our presence in another key semiconductor manufacturing region for automotive and industrial applications. This customer works closely with several automotive manufacturers in Taiwan and China, as well as with other international companies.

“The outlook for electric vehicles continues to improve following a period of inventory adjustments across parts of the automotive market. Industry forecasts point to renewed growth in Europe, increasing electrification initiatives in Japan, and continued leadership by China, where electric vehicles now account for more than half of new passenger vehicle sales. At the same time, the transition toward higher-voltage vehicle architectures, faster charging systems, and improved drivetrain efficiency is increasing demand for advanced silicon carbide power semiconductors that require the highest levels of reliability.

“We are also seeing growing interest in WLBI from customers developing silicon carbide devices for industrial automation, renewable energy, energy storage, charging infrastructure, aerospace, and AI data center power systems. As these markets continue to expand and reliability requirements become increasingly stringent, we believe Aehr is uniquely positioned with the industry’s most proven production WLBI solution.

“With an expanding installed base, a growing pipeline of production opportunities, and increasing engagement with both leading automotive suppliers and silicon carbide device manufacturers worldwide, we are excited about the opportunities ahead and believe we are well positioned to benefit as silicon carbide WLBI adoption accelerates.”

About Aehr Test Systems

Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including advanced artificial intelligence (AI) processors, silicon photonics, data and telecommunications infrastructure, electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, and solid-state memory and storage are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr’s products and solutions. Aehr has developed and introduced several innovative products including the FOX-P^TM families of test and burn-in systems and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full-wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full-wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr’s new line of high-power package-level reliability/burn-in test solutions for AI semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turnkey provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Safe Harbor Statement

Contacts:
Aehr Test Systems Vernon Rogers EVP of Sales & Marketing vrogers@aehr.com	PondelWilkinson, Inc. Todd Kehrli or Jim Byers Analyst/Investor Contact tkehrli@pondel.com jbyers@pondel.com

The post Aehr Receives More Than $8 Million in New Silicon Carbide Wafer-Level Burn-In Orders as Global Electric Vehicle Programs Accelerate appeared first on Aehr Test Systems.