Aehr Test Systems to Exhibit at the 2018 International Test Conference in Phoenix, Arizona Oct 28 – Nov 2
FREMONT, Calif., Oct. 29, 2018 (GLOBE NEWSWIRE) — Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will be showcasing its FOX-XPTM next generation multi-wafer test and burn-in systems for high volume production and early failure rate (EFR) test in booth 315 at the 2018 International Test Conference (ITC) taking place October 28-November 2 in Phoenix, Arizona at the Phoenix Convention Center.
ITC is the world’s premier conference dedicated to electronics test. This year features numerous topics including emerging test needs for artificial intelligence, automotive and IoT, hardware security, system test, analog and mixed-signal test, yield learning, test analytics, test methodology, benchmarks, test standards, memory and 3D test, diagnosis, DFT architectures, and functional and software-based test. There will also be focus Workshops on both Automotive Reliability and Test (ART 2018) and Silicon Photonics Design and Test (SPDT 2018).
Aehr Test President and CEO Gayn Erickson commented, “Aehr Test supplies complete test and burn-in solutions for reliability screening and production to ensure that the devices meet their reliability targets. As more new product designs challenge traditional test and reliability screening methodologies, Aehr’s wafer-level and singulated die/module production test and burn-in capabilities offer a cost-effective solution for high volume production.”
ITC Tutorials and the Automotive Workshop this year highlight the IC industry’s drive towards “Zero Defect” IC quality – especially in the expanding automotive market. With the anticipated emergence of autonomous vehicles, reliability and safety are paramount issues for automotive manufacturers and especially their customers. In addition, these requirements are important for reliability-critical applications such as sensors and security devices in mobile smartphones and tablets, and are creating new need for reliability and assurance of operation in wearable biosensors. The Silicon Photonics Design and Test Workshop focuses on the expanded use of photonics devices in data communications and other applications. Aehr Test’s reliability screening solutions directly address the needs to be discussed in both the Automotive and Silicon Photonics Workshops.
”Aehr Test is a unique supplier of both complete production solutions as well as subsystems, including chambers, electronics, and thermal control, that can be combined with applications-specific hardware designed with or provided by the customer,” Erickson added. “Aehr partners with our customers to develop solutions to meet their needs for a range of new applications where solutions are needed to test and burn-in devices in their application environment.”
The solutions Aehr Test will feature at its ITC exhibit booth include:
- The FOX-XP system, the company’s next-generation multi-wafer and now singulated die/module test solution is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer form before they are assembled into single or multi-die stacked packages. The FOX wafer-level systems utilize Aehr Test’s FOX WaferPakTM Contactors, which provide cost effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The new configuration with the DiePak® Carriers also enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die, single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, photonics devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.
- The ABTSTM family of packaged part burn-in and test systems is based on a state-of-the-art hardware and software platform that is designed to address not only today’s devices, but also future devices for many years to come. This system can test and burn-in high pin-count devices with configurations for both high-power and low-power applications.
The key feature of the FOX-XP test cell that contributes to its cost-effectiveness is the ability to provide up to 2,048 “Universal Channels” per wafer or DiePak carrier, enabling the system to test all the devices on the wafer or DiePak Carrier in parallel. The innovative “Universal Channel” architecture allows any channel to perform any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.
A single FOX-XP test system may be configured with up to 18 slots of test resources enabling up to 18 WaferPak Contactors or DiePak Carriers to be tested simultaneously. The FOX-XP system also offers per slot high performance thermal chucks to enable managing the temperature of the high power density devices under test, and an 18-slot test system footprint similar to typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time.
With the highest wafer throughput available in the ATE industry, the flexibility of Aehr Test’s new “Universal Channel” architecture, and the ability to perform both functional pattern verification and parametric testing at full-wafer parallel test, the FOX-XP system provides a highly differentiated solution from competitive alternatives.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.
|Aehr Test Systems
EVP Sales and Marketing
(510) 623-9400 x215
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Todd Kehrli or Jim Byers