Aehr Test Systems to Exhibit at the 2018 International Wafer-Level Packaging Conference in San Jose, CA Oct 23 – 25

FREMONT, Calif., Oct. 23, 2018 (GLOBE NEWSWIRE) — Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will be featuring its FOX-XPTM next generation multi-wafer test and burn-in systems for high volume production and early failure rate (EFR) test in booth 51 at the 15th Annual International Wafer-Level Packaging Conference (IWLPC) taking place October 23 – 25 in San Jose, California at the DoubleTree by Hilton Hotel San Jose.

IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. Interconnecting Wafer-Level Packaging, 3D Packaging, and Advanced Manufacturing and Test, the International Wafer-Level Packaging Conference is at the forefront of the packaging technology evolution. The Wafer-Level Packaging (WLP) track features sessions on package reliability, integration technology, wafer-level fan-out process and metrology, and panel-level fan-out packaging. The Advanced Manufacturing track features sessions on inspection & test, new methods & materials, and process and technology.

Aehr Test President and CEO Gayn Erickson commented, “Aehr Test supplies complete test and burn-in solutions for reliability screening and production of WLP devices to ensure that the devices meet their reliability targets, which is the core of this conference. As more new product designs challenge traditional test and reliability screening methodologies, Aehr’s wafer-level and singulated die/module production test and burn-in capabilities offer a cost-effective solution for high volume production. Reliability-critical applications include automotive vehicle control and sensor systems, sensors and security devices in mobile smartphones and tablets, and an entire new need for reliability and assurance of operation in wearable biosensors.”

The solution Aehr Test will feature at its IWLPC exhibit booth is the FOX-XP system, the company’s next-generation multi-wafer and now singulated die/module test solution. The FOX-XP system is capable of functional test and burn-in/cycling of WLP products including flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer or multi-die panel form. The FOX wafer-level systems utilize Aehr Test’s FOX WaferPakTM Contactors, which provide cost-effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer or multi-panel environment. The latest configuration with DiePak® Carriers also enables burn-in of singulated WLP die and multi-die modules to screen for defects in both the die and the WLP assembly process. The resulting known-good die, multi-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.

The key feature of the FOX-XP test cell that contributes to its cost-effectiveness is the ability to provide up to 2,048 “Universal Channels” per wafer or DiePak carrier, enabling the system to test all the devices on the wafer or DiePak Carrier in parallel. The innovative “Universal Channel” architecture allows any channel to perform any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.

A single FOX-XP test system may be configured with up to 18 slots of test resources enabling up to 18 WaferPak Contactors or DiePak Carriers to be tested simultaneously. The FOX-XP system also offers per slot high performance thermal chucks to manage the temperature of the high power density devices under test. The footprint of an 18-slot FOX-XP system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time.

With the highest wafer throughput available in the ATE industry, the flexibility of Aehr Test’s new “Universal Channel” architecture, and the ability to perform both functional pattern verification and parametric testing at full-wafer parallel test, the FOX-XP system provides a highly differentiated solution for reliability qualifications and production burn-in of WLP devices to ensure the production of highly reliable devices.

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at

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