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Multi Wafer Level Burn-in and Test Solutions

FOX-XP

The FOX-XP system offers a versatile test and burn-in solution for full wafer testing with WaferPak Contactors. Enhance throughput with the optional FOX-XP WaferPak Aligner, streamlining wafer alignment into FOX WaferPak Contactors.

 

Aehr Test Systems delivers comprehensive production wafer testing solutions, enhancing yield and reliability throughout your product manufacturing process.

FOX-XP with Automatic WaferPak Aligner

Advanced Test System for Multiple Wafers with Automatic Wafer Handling System

Efficient High-Throughput Automated Solution for Burn-in and Testing of Logic, Memory, Photonic, and Power Devices
  • Optimized High-Throughput System for Reliability Verification and Testing in Volume Production
    • Accommodates full wafers, panels, singulated dies, and modules, maximizing production efficiency.
    • Detects defects in logic, memory, photonic, and power dies before final packaging integration.
    • Up to 18 Blades (slots) for wafer or panel examination using WaferPak™ contactors.
    • Supports up to 9 Blades for precise testing of wafer, singulated die and module DiePak® carriers.
    • Advanced high-power testing capability with up to 3,500 watts of power per wafer
  • Flexible Channel Resource Configuration for Enhanced Versatility
    • Each Blade (slot) supports various resource modules: Universal Channel Modules, High Voltage Channel Modules, and High Current Channel Modules.
    • Offers up to 2,048 Universal Channel resources per Blade, including I/O, Clock, PPMU, and DPS, with deep scan, pattern data, and capture memory per channel for testing devices with BIST/DFT capabilities.
    • Provides up to 1,024 resources per Blade for high voltage (up to 29V) and high current (up to 2A) source requirements.
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Lowers testing expenses by enabling functional testing of wafers, dies, and modules during the reliability verification process.
    • Provides a comprehensive solution when equipped with a WaferPak contactor or DiePak carrier, complemented by a Wafer Aligner or DiePak Loader.
    • Ensures device safety with individual per-channel protection against over-current and over-voltage incidents.
  • Integrated Automated Wafer Handling and Alignment System
    • Fully automated material handling in a hands-free operation.
    • Compatible with wafers up to 300 mm in size for handling and alignment.
    • Fully integrated with FOX-XP Systems.

FOX-XP

Advanced Test System for Multiple Wafers and Individual Die/Modules

Efficient High-Throughput Solution for Burn-in and Testing of Logic, Memory, Photonic, and Power Devices
  • Optimized High-Throughput System for Reliability Verification and Testing in Volume Production
    • Accommodates full wafers, panels, singulated dies, and modules, maximizing production efficiency.
    • Detects defects in logic, memory, photonic, and power dies before final packaging integration.
    • Up to 18 Blades (slots) for wafer or panel examination using WaferPak™ contactors.
    • Supports up to 9 Blades for precise testing of wafer, singulated die and module DiePak® carriers.
    • Advanced high-power testing capability with up to 3,500 watts of power per wafer
  • Flexible Channel Resource Configuration for Enhanced Versatility
    • Each Blade (slot) supports various resource modules: Universal Channel Modules, High Voltage Channel Modules, and High Current Channel Modules.
    • Offers up to 2,048 Universal Channel resources per Blade, including I/O, Clock, PPMU, and DPS, with deep scan, pattern data, and capture memory per channel for testing devices with BIST/DFT capabilities.
    • Provides up to 1,024 resources per Blade for high voltage (up to 29V) and high current (up to 2A) source requirements.
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Lowers testing expenses by enabling functional testing of wafers, dies, and modules during the reliability verification process.
    • Provides a comprehensive solution when equipped with a WaferPak contactor or DiePak carrier, complemented by a Wafer Aligner or DiePak Loader.
    • Ensures device safety with individual per-channel protection against over-current and over-voltage incidents.

FOX-NP

Comprehensive Test System for Full Wafers and Individual Die/Modules

Compact and High-Power Testing and Reliability Verification Solution for Logic, Memory, Photonic, and Power Devices
  • Compact and Versatile High-Throughput Solution for Reliability Verification and Testing
    • Capable of handling applications involving full wafers, panels, singulated dies, and modules.
    • Efficiently detects failures in logic, memory, photonic, and power dies prior to final package integration.
    • Features a high-power thermal chuck with dual Blade (slot) capability, compatible with WaferPak™ contactors or DiePak® carriers for singulated die or module testing.
  • Economical High Power Wafer, Die, and Module Verification and Test Solution
    • Versatile channel resource configurations per Blade (slot), including Universal Channel Modules, High Voltage Channel Modules, or High Current Channel Modules.
    • Features up to 2,048 Universal Channel resources per Blade, encompassing I/O, Clock, PPMU, and DPS, equipped with deep scan, pattern data, and capture memory for each channel, ideal for testing devices with BIST/DFT.
    • Provides up to 1,024 high voltage (up to 29V) or high current (up to 2A) source resources per Blade.
  • Production Proven Full-Wafer Reliability Verification & Test Solution
    • Decreases testing expenses by enabling functional testing of wafers, dies, and modules during the reliability verification phase.
    • Provides an all-encompassing solution when set up with a WaferPak contactor or DiePak carrier, along with a Wafer Aligner or DiePak Loader.
    • Ensures device safety with individual per-channel protection against over-current and over-voltage.

Automatic WaferPak Aligner

Wafer Loader/Unloader for FOX WaferPak Contactors

  • Automated Solution for Loading, Aligning and Unloading of Wafers
    • Loads and unloads wafers between FOUPs or cassettes and WaferPak contactors
    • Dual FOUP/cassette interface enables automated handling of up to 50 wafers
    • Handles and aligns up to 300 mm wafer sizes
    • May be used with a FOX-XP or FOX-15 System
  • Production Proven Full-Wafer Burn-in & Test Solution
    • Based upon an industry-leading wafer prober platform
    • Optical bar code reading of FOUPs, Wafer IDs and WaferPak contactor IDs for error free operation and wafer traceability
    • May be integrated with a factory automated material handling systems
  • Precision Wafer Handling and Pad to Probe Alignment
    • Optical alignment via multiple cameras assures correct wafer to probe alignment and placement in a WaferPak contactor
  • Integrated Solution with FOX-XP system
    • Enables automated selection of test program based on wafer/lot ID
    • Shares traceability of wafers and test results with FOX-XP system

FOX-XP WaferPak Contactor

Efficient Single Touchdown System for Full-Wafer Testing and Burn-in

  • Optimized Delivery of FOX-XP System Resources for Single Touchdown Wafer Testing and Burn-in
    • Configurable for wafers up to 300 mm in size.
    • Demonstrated production reliability with over 50,000 contacts per wafer.
    • Compatible with various pad metallurgies including Aluminum (Al), Copper (Cu), Gold (Au), or solder balls.
    • Operates across a temperature range from ambient to 150° C.
  • Enhanced Channel and Power Handling Capabilities
    • Supports up to 2,048 I/O and DPS channels, featuring remote voltage and ground sense for each pin.
    • Capable of handling up to 4 amps per contact.
  • Capable of Managing up to 2 Kilowatts of Power Dissipation
  • Facilitates High-Volume Full Wafer Production Testing and Burn-in with a Single Touchdown Approach
  • Carrier Designed for Easy Field Repairability