Burn-in and Test for High Volume Production
FOX-1P Test & Burn-in System
Full-Wafer Test & Burn-in System
The FOX-1P system is configurable with up to 16,384 test resource channels enabling testing of thousands of die in a single touchdown using industry standard probe
FOX-XP Test & Burn-in System
Multi-Wafer & Singulated Die Test & Burn-in System
The FOX-XP system is a highly flexible test/burn-in system which may be configured to support WaferPak Contactors for full wafer test or DiePak Carriers for singulated
ABTS Test & Burn-in System
Packaged Part Test & Burn-in System
The ABTS system provides flexiblity for the test / burn-in of packaged semiconductor devices.
WaferPak Full-Wafer Contactors
The FOX system WaferPak Contactors are designed for single touchdown, full-wafer test / burn-in for high volume production.
- Over 50,000 pin capability
- Multiple contactor technology options
- Low cost per contact
DiePak Singulated Die/Module Carriers
The FOX system DiePak Carriers are designed for production test / burn-in of modules and singulated die.
- Handles up to 1,024 devices per DiePak Carrier
- Custom designed DiePak sockets
- Handles 2kW of device heat per DiePak Carrier
WaferPak Aligner and DiePak Loader
The WaferPak Aligner loads/aligns wafers into a WaferPak Contactor and the DiePak Loader performs automatic loading/unloading of modules/singulated die in the DiePak Carrier.
Package Part and System Level Test Burn-in Boards
The ABTS system BIBs are designed for packaged part test / burn-in and system level test / burn-in.
- Up to 72 BIB slots in an ABTS wide system
- Custom designed BIB solutions
- High temperature capability
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