Product Selection Matrix

Advanced Burn-in and Test System for packaged parts

  • ABTS-L — Logic burn-in
  • ABTS-Li — High power logic – individual    temperature control
  • ABTS-M — Memory burn-in
  • ABTS-P — High capacity burn-in
  • ABTS-Pi — High power device burn-in
  • FOX-1P High Volume Production Test Solution

    • Production Proven Full-wafer tester solution
    • Configurable “Universal” resources
    • Enables parallel testing > 1,000 die in a single touchdown

    DiePak reusable, temporary package for bare die

    • Known Good Die solution
    • Can be used for burn-in and test
    • Loading and handling can be automated

    FOX-15 300mm Single Touchdown Burn-in and Test System

    • Up to 15 wafers at a time
    • Known Good Die solution
    • Lowers production cost

    Single Touchdown Full-Wafer Contactors for FOX Systems

    • Over 50,000 pin capability
    • Highly Flexible options
    • Low cost per contact

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